公开(公告)号：US12207568B2

公开(公告)日：2025-01-21

申请号：US18315401

申请日：2023-05-10

Applicant: Origin Quantum Computing Technology (Hefei) Co., Ltd

Inventor： Liangliang Ma ,  Bing You ,  Nianci Wang ,  Jie Zheng ,  Wenshu Liu

IPC: H10N60/01 ,  H10N60/12

Abstract: Disclosed are a fabrication method for a superconducting circuit and a superconducting quantum chip. The fabrication method includes: determining, on a substrate, a first junction region located between a first electrical element and a second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming a Josephson junction in the second junction region; detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range; if yes, separating the Josephson junction through cutting, and moving the Josephson junction to the first junction region; and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element.