公开(公告)号：US06395992B1

公开(公告)日：2002-05-28

申请号：US09449654

申请日：1999-11-30

申请人： Osamu Nakayama ,  Toshinori Hosoma ,  Takuhiro Ishii

发明人： Osamu Nakayama ,  Toshinori Hosoma ,  Takuhiro Ishii

IPC分类号： H05K100

CPC分类号： H05K1/056 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681

摘要： A three-dimensional wiring board comprises a metal base having a roughed surface, a heat-bonding type of polyimide film without using adhesive, bonded to the roughed surface and serving as an electric insulating layer, and a copper foil for a conductive layer, bonded to the other surface of the polyimide film. A method for manufacturing the wiring board comprises a roughing treatment process for plating or oxidizing the surface of a metal base, thereby forming a roughed surface, a contact bonding process for attaching a polyimide film to the roughed surface and a copper foil by thermocompression bonding, thereby forming a laminate material, a patterning process for etching the copper foil into a desired conductive pattern, and a bending process for bending the laminate material into a desired three-dimensional shape by press working.

摘要翻译： 三维布线板包括具有粗糙表面的金属基底，不使用粘合剂的热粘合型聚酰亚胺膜，结合到粗糙表面并用作电绝缘层，以及用于导电层的铜箔 到聚酰亚胺膜的另一个表面。 制造布线板的方法包括：对金属基材的表面进行电镀或氧化的粗加工处理，形成粗糙面，通过热压接合将聚酰亚胺膜与粗糙面接合的接触接合工艺和铜箔， 从而形成层压材料，将铜箔蚀刻成所需导电图案的图案化工艺，以及通过冲压加工将层压材料弯曲成所需三维形状的弯曲工艺。