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公开(公告)号：US20120322694A1
公开(公告)日：2012-12-20
申请号：US13545706
申请日：2012-07-10
申请人： Othon Rego Monteiro , Jonathan J. Brege , Lirio Quintero , Soma Chakroborty , Ashley D. Leonard , Chad F. Christian
发明人： Othon Rego Monteiro , Jonathan J. Brege , Lirio Quintero , Soma Chakroborty , Ashley D. Leonard , Chad F. Christian
CPC分类号： C09K8/032 , B82Y30/00 , C09K2208/10
摘要： A base fluid may contain nanoparticles where the base fluid may include a non-aqueous fluid, an aqueous fluid, and combinations thereof. The fluid may have a resistivity range of from about 0.02 ohm-m to about 1,000,000 ohm-m. The non-aqueous fluid may be a brine-in-oil emulsion, or a water-in-oil emulsion; and the aqueous fluid may be an oil-in-water emulsion, or an oil-in-brine emulsion; and combinations thereof. The addition of nanoparticles to the base fluid may improve or increase the electrical conductivity and other electrical properties of the fluid. The fluid may be a drilling fluid, a completion fluid, a production fluid, and/or a stimulation fluid.
摘要翻译： 基础流体可以包含纳米颗粒，其中基础流体可以包括非水性流体，水性流体及其组合。 流体可具有约0.02欧姆 - 约1,000,000欧姆 - 米的电阻率范围。 非水性流体可以是油包水乳液或油包水乳液; 并且水性流体可以是水包油乳液或盐水中的油包水乳液; 及其组合。 将纳米颗粒添加到基础流体中可以改善或增加流体的导电性和其它电性质。 流体可以是钻井液，完井液，生产流体和/或刺激流体。
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公开(公告)号：US20120181085A1
公开(公告)日：2012-07-19
申请号：US13345920
申请日：2012-01-09
IPC分类号： E21B21/06
CPC分类号： E21B21/066
摘要： One method for treating cuttings from a subsurface formation may include treating the cuttings with at least one surfactant and at least one stabilizing agent. The method may include contacting the cuttings with the stabilizing agent(s) before contacting the cuttings with the surfactant(s). Another method for treating drill cuttings includes returning the drill cuttings to a substantially water-wet condition by using at least one stabilizing agent to remove at least a portion of a hydrocarbon from the drill cuttings.
摘要翻译： 用于从地下地层处理切屑的一种方法可包括用至少一种表面活性剂和至少一种稳定剂处理切屑。 该方法可以包括在将切屑与表面活性剂接触之前使切屑与稳定剂接触。 用于处理钻屑的另一种方法包括通过使用至少一种稳定剂从钻屑中除去至少一部分烃，将钻屑返回到基本上水润的状态。
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