公开(公告)号：US20220255293A1

公开(公告)日：2022-08-11

申请号：US17609721

申请日：2020-02-12

申请人： PANASONIC CORPORATION

发明人： Takashi KANO ,  Hiroyuki HAGINO

IPC分类号： H01S5/024 ,  H01S5/22 ,  H01S5/40 ,  H01S5/343 ,  H01S5/30 ,  H01S5/026 ,  H01S5/14 ,  H01S5/0234

摘要： A semiconductor laser element includes a light emission layer and a plurality of waveguides to arranged in one direction. A semiconductor laser device includes the semiconductor laser element and a first base disposed, via a first adhesion layer, on one face in the lamination direction of the semiconductor laser element. The thermal resistance of the first adhesion layer is, in the arrangement direction of the plurality of waveguides to lower on one end portion side than on the other end portion side.