公开(公告)号：US20240092962A1

公开(公告)日：2024-03-21

申请号：US18284386

申请日：2022-03-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Taichi NAKASHIMA ,  Hiroyuki FUJISAWA ,  Akira OTSUKA ,  Koichi ISAJI ,  Hajime OGUSHI

IPC: C08F290/06 ,  C08J5/24 ,  C08K9/06 ,  H05K1/03

CPC classification number: C08F290/062 ,  C08J5/244 ,  C08J5/249 ,  C08K9/06 ,  H05K1/0366 ,  C08J2351/08

Abstract: A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).