公开(公告)号：US10723042B2

公开(公告)日：2020-07-28

申请号：US15905376

申请日：2018-02-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro Kanazawa ,  Tetsuji Shibata ,  Kazushige Sugita ,  Hiroshi Gouda ,  Naoki Kohyama

IPC: B23D61/18 ,  B28D5/04 ,  B23D57/00 ,  B28D5/00 ,  B22F5/12 ,  C22C1/04 ,  B23D65/00 ,  C22F1/18

Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 μm.

公开(公告)号：US10722962B2

公开(公告)日：2020-07-28

申请号：US15974918

申请日：2018-05-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro Kanazawa ,  Tetsuji Shibata ,  Kazushige Sugita ,  Hiroshi Gouda ,  Naoki Kohyama

IPC: B23D61/18 ,  B23D65/00 ,  C25D5/50 ,  C25D7/06 ,  C25D15/00 ,  C25D3/12

Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.