公开(公告)号：US20220139797A1

公开(公告)日：2022-05-05

申请号：US17431657

申请日：2020-01-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koji TAKAHASHI ,  Kazuhiro YAHATA ,  Yoshihisa MINAMI ,  Hiroki AKASHI ,  Shinya MIYAZAKI

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065

Abstract: The semiconductor module includes: a heat dissipation board including first to third wiring patterns; a first metal plate on the first wiring pattern, a second metal plate on the second wiring pattern, a first semiconductor chip and a first intermediate board which are on the first metal plate, a second semiconductor chip and a second intermediate board which are on the second metal plate. A first metal film on the first intermediate board is electrically connected to the first semiconductor chip and the second metal plate, and a second metal film on the second intermediate board is electrically connected to the second semiconductor chip and the third wiring pattern.

公开(公告)号：US20160071777A1

公开(公告)日：2016-03-10

申请号：US14404393

申请日：2014-03-13

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kazuhiro YAHATA ,  Takashi UNO ,  Hikaru IKEDA

IPC: H01L23/047 ,  H01L23/373 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/373 ,  H01L23/66 ,  H01L24/83 ,  H01L2223/6655 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/095 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.

Abstract translation: 半导体封装或半导体器件包括其上要放置半导体或匹配电路的散热器，要与半导体电连接的引线端子或散热器上的匹配电路，以及固定部件 其将引线端子固定到散热器，其中固定构件由其中混合有树脂和陶瓷粉末的复合树脂材料形成。