公开(公告)号：US20230212392A1

公开(公告)日：2023-07-06

申请号：US17927795

申请日：2021-04-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Lin LIN ,  Yuki KITAI

IPC: C08L71/08 ,  C08K7/18 ,  C08K7/22 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03

CPC classification number: C08L71/08 ,  C08K7/18 ,  C08K7/22 ,  C08J5/24 ,  C08J7/0427 ,  H05K1/0353 ,  C08L2207/53 ,  C08J2371/08

Abstract: A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.