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公开(公告)号：US20200270411A1
公开(公告)日：2020-08-27
申请号：US16649920
申请日：2018-09-28
Inventor： Yuki KITAI , Mikio SATO , Yasunori HOSHINO , Masashi KODA , Takayoshi OZEKI , Hiroaki FUJIWARA
Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.
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公开(公告)号：US20210246251A1
公开(公告)日：2021-08-12
申请号：US17050671
申请日：2019-04-22
Inventor： Mikio SATO , Hiroaki FUJIWARA , Yuki KITAI , Masashi KODA , Yasunori HOSHINO , Takayoshi OZEKI
IPC: C08F290/06 , C08J5/24 , B32B15/08 , B32B27/28 , H05K1/03
Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
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公开(公告)号：US20200223998A1
公开(公告)日：2020-07-16
申请号：US16651069
申请日：2018-09-28
Inventor： Yasunori HOSHINO , Hiroaki FUJIWARA , Yuki KITAI , Takayoshi OZEKI , Mikio SATO , Masashi KODA
Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.
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公开(公告)号：US20190061320A1
公开(公告)日：2019-02-28
申请号：US16072715
申请日：2017-01-24
Inventor： Yohsuke ISHIKAWA , Yoshiaki ESAKI , Takayoshi OZEKI , Jun TOCHIHIRA , Ryu HARADA
IPC: B32B15/088 , B32B15/08 , B32B27/08 , B32B27/28 , B32B27/32 , B32B27/42 , B32B27/34 , B32B15/20 , H05K1/03
Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.
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