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    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
    2.
    发明申请
    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD 有权

    公开(公告)号：US20220159830A1

    公开(公告)日：2022-05-19

    申请号：US17440528

    申请日：2020-03-26

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yasunori HOSHINO ,  Yuki KITAI ,  Atsushi WADA ,  Masashi KODA ,  Mikio SATO

    IPC: H05K1/03 ,  H05K1/05 ,  C08J5/24

    Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
    5.
    发明申请
    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD 审中-公开

    公开(公告)号：US20200270411A1

    公开(公告)日：2020-08-27

    申请号：US16649920

    申请日：2018-09-28

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yuki KITAI ,  Mikio SATO ,  Yasunori HOSHINO ,  Masashi KODA ,  Takayoshi OZEKI ,  Hiroaki FUJIWARA

    IPC: C08J5/24 ,  C08G65/48 ,  C08J3/24 ,  B32B15/08 ,  H05K1/03

    Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.

    PREPREG, AND METAL-CLAD LAMINATED BOARD AND WIRING SUBSTRATE OBTAINED USING SAME
    7.
    发明申请
    PREPREG, AND METAL-CLAD LAMINATED BOARD AND WIRING SUBSTRATE OBTAINED USING SAME 审中-公开

    公开(公告)号：US20200223998A1

    公开(公告)日：2020-07-16

    申请号：US16651069

    申请日：2018-09-28

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yasunori HOSHINO ,  Hiroaki FUJIWARA ,  Yuki KITAI ,  Takayoshi OZEKI ,  Mikio SATO ,  Masashi KODA

    IPC: C08J5/24 ,  H05K1/03

    Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.

    COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL
    10.
    发明申请
    COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL 有权

    公开(公告)号：US20220220272A1

    公开(公告)日：2022-07-14

    申请号：US17609695

    申请日：2020-05-14

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yuki KITAI ,  Masashi KODA ,  Yasunori HOSHINO ,  Atsushi WADA ,  Mikio SATO

    IPC: C08J7/06 ,  H05K1/03 ,  H05K3/02

    Abstract: A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m2.

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