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公开(公告)号：US20170265342A1
公开(公告)日：2017-09-14
申请号：US15610893
申请日：2017-06-01
发明人： Shuzo Yagi , Takashi Tamura , Hiroki Yamamoto , Toru Ikeda , Kazuhiro Kishikawa
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , H05K13/0411 , H05K13/0434 , Y10T29/4913 , Y10T29/53174
摘要： In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
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公开(公告)号：US10383269B2
公开(公告)日：2019-08-13
申请号：US15610893
申请日：2017-06-01
发明人： Shuzo Yagi , Takashi Tamura , Hiroki Yamamoto , Toru Ikeda , Kazuhiro Kishikawa
IPC分类号： H05K13/04
摘要： In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
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