公开(公告)号：US20200332078A1

公开(公告)日：2020-10-22

申请号：US16757677

申请日：2018-10-12

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Ryuji TAKAHASHI ,  Shimpei OBATA ,  Yasunori AMBE ,  Tomo MUGURUMA

IPC: C08J5/24 ,  C08L61/06 ,  C08G8/08 ,  H05K1/03 ,  B32B15/08 ,  B32B15/20 ,  B32B5/02

Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

公开(公告)号：US20220025171A1

公开(公告)日：2022-01-27

申请号：US17311542

申请日：2019-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomo MUGURUMA ,  Ryuji TAKAHASHI ,  Shimpei OBATA ,  Yasunori AMBE

IPC: C08L63/00 ,  C08J5/24 ,  C08J5/18 ,  H05K1/03

Abstract: A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.