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公开(公告)号:US20210028207A1
公开(公告)日:2021-01-28
申请号:US17067151
申请日:2020-10-09
Inventor: Yuuko TOMEKAWA , Takahiro KOYANAGI , Hiroyuki AMIKAWA , Yasuyuki ENDOH
IPC: H01L27/146
Abstract: An imaging device includes: a semiconductor substrate; a first photoelectric converter which is disposed in the semiconductor substrate; a second photoelectric converter different from the first photoelectric converter, which is disposed in the semiconductor substrate; a wiring layer disposed on or above the semiconductor substrate; and a capacitor which is disposed in the wiring layer and surrounds the first photoelectric converter in plan view. The capacitor includes a first electrode, a second electrode, and a dielectric layer disposed between the first electrode and the second electrode. The first electrode is connected to one of the first photoelectric converter and the second photoelectric converter.
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公开(公告)号:US20190288020A1
公开(公告)日:2019-09-19
申请号:US16431277
申请日:2019-06-04
Inventor: Makoto IKUMA , Hiroyuki AMIKAWA , Takayasu KITO , Shinichi OGITA , Junichi MATSUO , Yasuyuki ENDOH , Katsumi TOKUYAMA , Tetsuya ABE
IPC: H01L27/146 , H01L27/142 , H04N5/235 , H04N5/232 , H04N5/225
Abstract: A solid-state imaging apparatus includes a plurality of high-sensitivity pixels that are arranged in a matrix, and perform a photoelectric conversion at a predetermined sensitivity; a plurality of low-sensitivity pixels that are arranged in a matrix in gaps between the plurality of high-sensitivity pixels, and perform a photoelectric conversion at a lower sensitivity than the predetermined sensitivity; and a signal processor that generates a pixel signal by (i) detecting a difference signal between a signal from the plurality of high-sensitivity pixels and a signal from the plurality of low-sensitivity pixels, and (ii) correcting the signal from the plurality of high-sensitivity pixels using the difference signal.
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