SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
    3.
    发明申请
    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS 有权
    固态成像装置和成像装置

    公开(公告)号:US20160014363A1

    公开(公告)日:2016-01-14

    申请号:US14858481

    申请日:2015-09-18

    CPC classification number: H04N5/374 H04N5/3577 H04N5/3698 H04N5/3745 H04N5/378

    Abstract: A solid-state imaging device includes: a plurality of unit cells each including at least one light receiving unit and an amplifying transistor which outputs an amplified signal corresponding to an amount of the signal charge photoelectrically converted by the light receiving unit; a plurality of vertical signal lines each for receiving an output signal from the amplifying transistor; a pixel power supply line for supplying a power supply voltage to the amplifying transistor; a plurality of constant current source transistors each connected to a different one of the vertical signal lines; and a bias circuit which controls an amount of current to be supplied to each of the constant current source transistors, based on a variation in the power supply voltage.

    Abstract translation: 固态成像装置包括:多个单位电池,每个单元电池包括至少一个光接收单元和放大晶体管,其输出对应于由光接收单元光电转换的信号电荷的量的放大信号; 多个垂直信号线,各自用于接收来自放大晶体管的输出信号; 用于向放大晶体管提供电源电压的像素电源线; 多个恒流源晶体管,每个连接到所述垂直信号线中的不同的一个; 以及偏置电路,其基于电源电压的变化来控制要提供给每个恒流源晶体管的电流量。

    IMAGING DEVICE HAVING CAPACITOR SURROUNDING FIRST PHOTOELECTRIC CONVERTER IN PLAN VIEW

    公开(公告)号:US20210028207A1

    公开(公告)日:2021-01-28

    申请号:US17067151

    申请日:2020-10-09

    Abstract: An imaging device includes: a semiconductor substrate; a first photoelectric converter which is disposed in the semiconductor substrate; a second photoelectric converter different from the first photoelectric converter, which is disposed in the semiconductor substrate; a wiring layer disposed on or above the semiconductor substrate; and a capacitor which is disposed in the wiring layer and surrounds the first photoelectric converter in plan view. The capacitor includes a first electrode, a second electrode, and a dielectric layer disposed between the first electrode and the second electrode. The first electrode is connected to one of the first photoelectric converter and the second photoelectric converter.

    SOLID-STATE IMAGING APPARATUS, METHOD FOR DRIVING THE SAME, AND IMAGING APPARATUS
    6.
    发明申请
    SOLID-STATE IMAGING APPARATUS, METHOD FOR DRIVING THE SAME, AND IMAGING APPARATUS 有权
    固态成像装置,其驱动方法和成像装置

    公开(公告)号:US20150076327A1

    公开(公告)日:2015-03-19

    申请号:US14554038

    申请日:2014-11-26

    Abstract: A solid-state imaging apparatus includes a plurality of pixel cells arranged in a pixel array unit, a vertical signal line and a pixel power supply line each connected to a source electrode and a drain electrode of an amplifying transistor, a Pch transistor for supplying potential AVDD to the vertical signal line, a Pch transistor for supplying potential PBIAS_H higher than the potential AVDD to the vertical signal line, a Pch transistor for supplying the potential PBIAS_H to the pixel power supply line, wherein while the transfer transistor is turned ON and transfers signal charges photoelectrically converted by a photodiode to the floating diffusion portion, the Pch transistors are turned ON and the potential PBIAS_H is applied to the vertical signal line and the pixel power supply line.

    Abstract translation: 固态成像装置包括排列在像素阵列单元中的多个像素单元,垂直信号线和每个连接到放大晶体管的源电极和漏电极的像素电源线,用于提供电位的Pch晶体管 对垂直信号线的AVDD,用于向垂直信号线提供高于电位AVDD的电位PBIAS_H的Pch晶体管,用于将电位PBIAS_H提供给像素电源线的Pch晶体管,其中当转移晶体管导通并转移时 信号电荷由光电二极管光电转换成浮动扩散部分,Pch晶体管导通,电位PBIAS_H施加到垂直信号线和像素电源线。

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