公开(公告)号：US3821847A

公开(公告)日：1974-07-02

申请号：US22098172

申请日：1972-01-26

Applicant: PHILIPS CORP

Inventor： MELSE J ,  GROENEWEGEN M

IPC: H01L23/495 ,  H05K3/18 ,  H05K3/24 ,  C23B5/68

CPC classification number: H05K3/185 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/241 ,  Y10S428/931 ,  Y10S428/935 ,  Y10T29/49121 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Patterns of conductors which are destined as current supply members of a semiconductor body, for example, an integrated circuit, are provided on an insulating flexible foil of a synthetic material resin. Each pattern of conductors consists of two groups of conductors. In order to be able to provide the conductors in series production by electrodeposition, a large number of rows of conductor tracks is provided on the foil, the outer ends of the conductor tracks of corresponding groups in a row being connected to a continuous metal track. A connection track between the metal tracks is provided between at least a number of successive patterns of conductors in a row. The tracks are then covered by means of an electrodeposition process by at least one metal layer of the desirable thickness.

Abstract translation: 在合成材料树脂的绝缘柔性箔上设置作为半导体体的电流供给部件的导体的图案，例如集成电路。 每个导体图案由两组导体组成。 为了能够通过电沉积串联制造导体，在箔上提供了大量的导体轨迹排，连续的连续的金属轨道连接在一起的相应组的导体轨迹的外端。 金属轨道之间的连接轨道被提供在一行中至少多个连续的导体图案之间。 然后通过至少一个所需厚度的金属层通过电沉积工艺覆盖轨道。