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公开(公告)号：US20220267520A1
公开(公告)日：2022-08-25
申请号：US17624839
申请日：2019-10-30
发明人： In Hwan Hwang , Gyeong Hyeon Ro , Ik Sang Lee
IPC分类号： C08G69/26 , C08G73/10 , C09D179/08 , H01B3/30
摘要： The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, a polyimide comprising the same, and a coating material comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity and heat resistance, and insulation properties, adhesion and mechanical properties in a harsh condition such as a high temperature simultaneously, a method for preparing the polyamic acid composition, a polyimide comprising the same and a coating material comprising the same.
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公开(公告)号：US11905431B2
公开(公告)日：2024-02-20
申请号：US17270006
申请日：2018-11-13
发明人： In Hwan Hwang , Ik Sang Lee , Jeong Yeul Choi
IPC分类号： C09D179/08 , H01B3/30 , H01B13/06 , C08K5/092 , C08K5/521
CPC分类号： C09D179/08 , C08K5/092 , H01B3/306 , H01B13/06 , C08K5/521 , C08K5/521 , C08L79/08 , C08K5/5419 , C08L79/08 , C08K5/092 , C08L79/08
摘要： The present invention is a polyimide varnish for conductor coating, which provides a polyimide varnish comprising: a polyamic acid solution prepared through polymerization of at least one dianhydride monomer and at least one diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; an alkoxy silane coupling agent; and an antioxidant, wherein the polyimide varnish has a solid content of 15 to 38 wt % on the basis of the total weight thereof, and a viscosity at 23° C. of 500 to 9,000 cP, and the coated material prepared from the polyimide varnish has a degree of softening resistance of 520° C. or higher, and a breakdown voltage (BDV) of 8 kV/mm or higher.
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公开(公告)号：US20220119676A1
公开(公告)日：2022-04-21
申请号：US17417643
申请日：2019-11-29
发明人： Gyeong Hyeon Ro , Ik Sang Lee
IPC分类号： C09D179/08 , C08G73/10 , H01L27/12 , B29C41/00 , B29C41/42
摘要： The present invention provides a polyamic acid composition, which, in a cured state on a substrate of amorphous or crystalline silicon, has an adhesion of 0.05-0.1 N/cm with the amorphous or crystalline silicon.
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公开(公告)号：US20240218126A1
公开(公告)日：2024-07-04
申请号：US18393163
申请日：2023-12-21
发明人： Hosung Lee , Ik Sang Lee , Minseok Yang
IPC分类号： C08G73/10
CPC分类号： C08G73/1071 , C08G73/1032 , B29C43/003
摘要： Provided is a polyimide molded product comprising polyimide powder obtained by imidizing a dianhydride monomer and a diamine monomer, in which a bidirectional coefficient of thermal expansion (CTEBi-direction) according to Equation 1 below in the range of 25° C. to 300° C. is 0.7 to 1.5:
Bidirectinal
coefficient
of
thermal
expansion
(
CTE
Bi
-
direction
)
=
Transverse
coefficient
of
thermal
expansion
(
CTE
x
)
/
Longitudinal
coefficient
of
thermal
expansion
(
CTE
y
)
=
C
T
E
x
/
CTE
y
.
[
Equation
1
]-
公开(公告)号：US20220282088A1
公开(公告)日：2022-09-08
申请号：US17624834
申请日：2019-10-30
发明人： In Hwan Hwang , Gyeong Hyeon Ro , Ik Sang Lee
摘要： The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, and a polyimide comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity, and heat resistance and mechanical properties simultaneously, a method for preparing the polyamic acid composition and a polyimide comprising the same.
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公开(公告)号：US20220227941A1
公开(公告)日：2022-07-21
申请号：US17610999
申请日：2019-11-28
发明人： Gyeong Hyeon Ro , In Hwan Hwang , Ik Sang Lee
摘要： The present application relates to a polyimide and a manufacturing method therefor, thereby providing a polyimide capable of implementing excellent adhesion force while maintaining the inherent characteristics of the polyimide, and a manufacturing method therefor.
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公开(公告)号：US20220267528A1
公开(公告)日：2022-08-25
申请号：US17624837
申请日：2019-10-30
发明人： In Hwan Hwang , Gyeong Hyeon Ro , Ik Sang Lee
IPC分类号： C08G73/10 , C09D179/08 , H01B3/30
摘要： The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, a polyimide comprising the same, and a coating material comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity and heat resistance, and insulation properties and mechanical properties in a harsh condition such as a high temperature simultaneously, a method for preparing the polyamic acid composition, a polyimide comprising the same and a coating material comprising the same.
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公开(公告)号：US20220010070A1
公开(公告)日：2022-01-13
申请号：US17294620
申请日：2019-10-30
发明人： Ik Sang Lee , Joo Young Kirn , Gyeong Hyeon Ro
摘要： The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon O2 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.
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公开(公告)号：US20220002489A1
公开(公告)日：2022-01-06
申请号：US17294960
申请日：2019-11-19
发明人： Gyeong Hyeon Ro , Ik Sang Lee
摘要： The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon 02 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.
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公开(公告)号：US20210198521A1
公开(公告)日：2021-07-01
申请号：US17270006
申请日：2018-11-13
发明人： In Hwan Hwang , Ik Sang Lee , Jeong Yeul Choi
IPC分类号： C09D179/08 , H01B3/30 , H01B13/06
摘要： The present invention is a polyimide varnish for conductor coating, which provides a polyimide varnish comprising: a polyamic acid solution prepared through polymerization of at least one dianhydride monomer and at least one diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; an alkoxy silane coupling agent, and an antioxidant, wherein the polyimide varnish has a solid content of 15 to 38 wt % on the basis of the total weight thereof, and a viscosity at 23° C. of 500 to 9,000 cP, and the coated material prepared from the polyimide varnish has a degree of softening resistance of 520° C. or higher, and a breakdown voltage (BDV) of 8 kV/mm or higher.
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