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公开(公告)号：US20190139951A1
公开(公告)日：2019-05-09
申请号：US16235118
申请日：2018-12-28
Applicant: PixArt Imaging Inc.
Inventor： CHEE-PIN T'NG , SAI-MUN LEE
Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
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公开(公告)号：US20240222308A1
公开(公告)日：2024-07-04
申请号：US18149121
申请日：2023-01-02
Applicant: PIXART IMAGING INC.
Inventor： SAI-MUN LEE , CHEE-PIN T'NG
IPC: H01L23/00
CPC classification number: H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0603 , H01L2224/06155 , H01L2224/06181 , H01L2224/29007 , H01L2224/29013 , H01L2224/29015 , H01L2224/29021 , H01L2224/29023 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/3015 , H01L2224/30505 , H01L2224/30517 , H01L2224/32227 , H01L2224/48227 , H01L2224/4912 , H01L2224/73265 , H01L2224/83192 , H01L2924/0665
Abstract: A sensor packaging method and a sensor package are provided. The method includes: providing a substrate having upper and lower board surfaces, in which the upper board surface has a die-bonding region. The substrate includes a core material layer, an upper metal layer, and an upper protection layer, a first window is formed to penetrate the upper protection layer and located at a periphery of the die-bonding region, and the first window is opened for a first ground electrode connected to a first ground portion. The method further includes: performing a dispensing step to apply an adhesive material on the upper board surface in at least a portion of the die-bonding region; and attaching a sensor die to the substrate through the adhesive material, in which the sensor die is disposed in the die-bonding region and has a first ground pin electrically connected to the first ground electrode.
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公开(公告)号：US20230120755A1
公开(公告)日：2023-04-20
申请号：US18083619
申请日：2022-12-19
Applicant: PIXART IMAGING INC.
Inventor： CHEE-PIN T'NG , SAI-MUN LEE
Abstract: There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
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公开(公告)号：US20210143139A1
公开(公告)日：2021-05-13
申请号：US17155258
申请日：2021-01-22
Applicant: PixArt Imaging Inc.
Inventor： CHEE-PIN T'NG , SAI-MUN LEE
Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
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