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公开(公告)号：US20240150924A1
公开(公告)日：2024-05-09
申请号：US18280811
申请日：2021-03-22
申请人： POSCO CO., LTD
发明人： Jin-Ho Jung , Won-Hwi Lee , Kkoch-Nim Oh , Sang-Bae Lim
摘要： A method for removing ferric ions contained in a sulfate-based iron electroplating solution comprises a step of regeneration for reduction of the ferric ions by circulating a ferric ion-containing sulfate-based iron electroplating solution in a solution bath containing ferrous metal charged therein, wherein the ferrous metal is charged in an amount that satisfies the following formula (1): S≥0.01 Iconv/Cmax (1). In formula (1), S indicates a total surface (m2) of ferrous metal, Cmax indicates a maximum permissible ion concentration level (g/L) of the ferric ions in the solution, and Iconv indicates, as represented by the following formula (2), converted current (A) obtained by dividing the sum of current (I) applied to an electroplated cell during the plating time (tp, sec) by the regeneration time (tr, sec) for reduction of the ferric ions in an electrolyte.
I
conv
=
∫
Idt
p
∫
dt
r-
2.发明公开公开(公告)号：US20240044032A1
公开(公告)日：2024-02-08
申请号：US18267010
申请日：2020-12-14
申请人： POSCO Co., Ltd
发明人： Jin-Ho Jung , Won-Hwi Lee , Sang-Bae Lim
IPC分类号： C25D3/20
CPC分类号： C25D3/20
摘要： The present invention relates to a solution for electroplating iron, comprising: iron ions comprising first iron ions and second iron ions; a complexing agent; and unavoidable impurities, wherein the amount of second iron ions among the iron ions is 5 to 60 wt %. According to the present invention, electroplating efficiency is high, there is no drop in electroplating efficiency due to a continuous plating operation, and sludge generation is prevented, and, thus, the plating solution is easily managed. Burning can be prevented even in a high current density operation, and, thus, a high-quality iron-plated layer can be achieved. The plating solution does not need to be replaced, as the concentration of second iron ions generated by a plating reaction is maintained to be constant, and, thus, the present invention is appropriate for a continuous plating process.
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