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公开(公告)号：US10023939B2
公开(公告)日：2018-07-17
申请号：US15715892
申请日：2017-09-26
IPC分类号： C22C5/02 , B08B3/08 , C23C14/14 , C22B9/14 , C23C14/56 , B21C1/00 , B24B31/06 , C23G1/10 , B21C47/02 , C22B3/00 , C23C14/24 , B08B3/10 , B08B3/12 , B24B39/00
摘要： A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.
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公开(公告)号：US20180029096A1
公开(公告)日：2018-02-01
申请号：US15715892
申请日：2017-09-26
IPC分类号： B21C1/00 , B24B39/00 , C22B9/14 , C23C14/56 , C22C5/02 , C23C14/14 , C23G1/10 , B21C47/02 , C22B3/00 , C23C14/24 , B08B3/10 , B08B3/12 , B08B3/08 , B24B31/06
CPC分类号： C22C5/02 , B08B3/08 , B08B3/10 , B08B3/12 , B21C1/00 , B21C1/003 , B21C47/02 , B24B31/06 , B24B39/00 , C22B9/14 , C22B11/04 , C23C14/14 , C23C14/24 , C23C14/564 , C23G1/10
摘要： A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.
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