Preformed EMI/RFI shielding compositions in shaped form
    1.
    发明申请
    Preformed EMI/RFI shielding compositions in shaped form 审中-公开
    成形的EMI / RFI屏蔽组合物

    公开(公告)号:US20040220327A1

    公开(公告)日:2004-11-04

    申请号:US10837337

    申请日:2004-04-30

    CPC classification number: C08K7/06 C08K9/02 C08L81/04

    Abstract: Electrically conductive preformed compositions comprising sulfur-containing polymers in shaped form and the use of preformed compositions in shaped form to seal apertures are disclosed. The preformed compositions can be used to seal an aperture having EMI/RFI shielding effectiveness.

    Abstract translation: 公开了导电预成型组合物,其包含成型形式的含硫聚合物和使用成形形式的预成型组合物来密封孔。 预成型组合物可用于密封具有EMI / RFI屏蔽效能的孔。

    Low VOC coating composition
    2.
    发明申请
    Low VOC coating composition 审中-公开
    低VOC涂料组合物

    公开(公告)号:US20010031362A1

    公开(公告)日:2001-10-18

    申请号:US09863048

    申请日:2001-05-22

    CPC classification number: C08G59/4085 C09D163/00 Y10T428/31511 C08L2666/28

    Abstract: A water based, low VOC coating includes an aqueous dispersion of an amine terminated epoxy resin and an organosilane curing agent of the formula: R1null(CH2)xnullSinull(R3)nnull(R2)3nulln; wherein R1 is an epoxide, an isocyanate, or an acrylic; R2 is an alkoxy group, acetoxy group, or an oximino group; R3 is a C1nullC6 alkyl group; X is an integer from 2-10; and n is 0 to 2.

    Abstract translation: 水性低VOC涂层包括胺封端的环氧树脂的水分散体和下式的有机硅烷固化剂:R1-(CH2)x-Si-(R3)n-(R2)3-n; 其中R1是环氧化物,异氰酸酯或丙烯酸; R2是烷氧基,乙酰氧基或肟基; R3是C1-C6烷基; X是2-10的整数; n为0〜2。

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