公开(公告)号：US11706553B1

公开(公告)日：2023-07-18

申请号：US17662233

申请日：2022-05-06

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： Yung-Tai Pan ,  Ting-Shuo Ku ,  Chun-Hsien Wu

IPC: H04R1/10

CPC classification number: H04R1/1008 ,  H04R1/1083 ,  H04R1/1091 ,  H04R2201/10 ,  H04R2460/11

Abstract: A headphone device includes a covering member, a sound chamber casing and a speaker unit. The sound chamber casing is combined with the covering member, so that a sound chamber is formed. The speaker unit is installed within the sound chamber. The sound chamber includes a gas channel. The gas channel has a bend portion.