公开(公告)号：US20240009747A1

公开(公告)日：2024-01-11

申请号：US18346838

申请日：2023-07-04

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  YOSHIAKI YUKIMORI ,  GEUNSIK AHN

IPC分类号： B23K3/06

CPC分类号： B23K3/0653 ,  B23K3/0623

摘要： According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

公开(公告)号：US20200144220A1

公开(公告)日：2020-05-07

申请号：US16365693

申请日：2019-03-27

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  YOSHIAKI YUKIMORI

IPC分类号： H01L23/00 ,  B23K3/06

摘要： Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.

公开(公告)号：US20200144219A1

公开(公告)日：2020-05-07

申请号：US16361230

申请日：2019-03-22

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  YOSHIAKI YUKIMORI

IPC分类号： H01L23/00 ,  H01L21/67

摘要： Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.