公开(公告)号：US20240009747A1

公开(公告)日：2024-01-11

申请号：US18346838

申请日：2023-07-04

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  YOSHIAKI YUKIMORI ,  GEUNSIK AHN

IPC分类号： B23K3/06

CPC分类号： B23K3/0653 ,  B23K3/0623

摘要： According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

公开(公告)号：US20200215645A1

公开(公告)日：2020-07-09

申请号：US16436943

申请日：2019-06-11

申请人： PROTEC CO., LTD.

发明人： GEUNSIK AHN

IPC分类号： B23K26/12 ,  H01L23/00 ,  H01L21/50 ,  B23K26/066

摘要： Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam.According to the mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

公开(公告)号：US20180366433A1

公开(公告)日：2018-12-20

申请号：US16011648

申请日：2018-06-19

申请人： PROTEC CO., LTD.

发明人： GEUNSIK AHN

IPC分类号： H01L23/00

摘要： Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.

公开(公告)号：US20240332233A1

公开(公告)日：2024-10-03

申请号：US18619137

申请日：2024-03-27

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  GEUNSIK AHN

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849

摘要： The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.

公开(公告)号：US20240314939A1

公开(公告)日：2024-09-19

申请号：US18605775

申请日：2024-03-14

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  GEUNSIK AHN

IPC分类号： H05K3/34 ,  B23K26/12 ,  B23K26/21 ,  B23K101/42

CPC分类号： H05K3/3489 ,  B23K26/1224 ,  B23K26/21 ,  H05K3/3452 ,  H05K3/3494 ,  B23K2101/42

摘要： Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposits having a high aspect ratio to accurate positions while being kept aligned vertically on the substrate.

公开(公告)号：US20180366435A1

公开(公告)日：2018-12-20

申请号：US16011649

申请日：2018-06-19

申请人： PROTEC CO., LTD.

发明人： GEUNSIK AHN

IPC分类号： H01L23/00 ,  B23K1/005

摘要： Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

公开(公告)号：US20240178182A1

公开(公告)日：2024-05-30

申请号：US18519056

申请日：2023-11-26

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  GEUNSIK AHN

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L2224/13147 ,  H01L2224/81123 ,  H01L2224/8117 ,  H01L2224/81224

摘要： A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

公开(公告)号：US20210335749A1

公开(公告)日：2021-10-28

申请号：US17365995

申请日：2021-07-01

申请人： PROTEC CO., LTD.

发明人： GEUNSIK AHN

IPC分类号： H01L23/00

摘要： Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

公开(公告)号：US20210335748A1

公开(公告)日：2021-10-28

申请号：US17237078

申请日：2021-04-22

申请人： PROTEC CO., LTD.

发明人： Youn Sung Ko ,  GEUNSIK AHN

IPC分类号： H01L23/00

摘要： Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.