摘要:
The method of electrophotographically manufacturing a screen assembly on an interior surface of a faceplate panel for a color CRT, according to the present invention includes the step of forming a photoreceptor by sequentially coating the surface of the panel with a conductive solution to form a volatilizable conductive layer and then overcoating the conductive layer with an organic photoconductive solution comprising a suitable resin, an electron donor material, an electron acceptor material, a surfactant and an organic solvent to form a volatilizable photoconductive layer. The photoconductive layer of the photoreceptor is resistant to cracking during filming, displays increased phosphor adherence during fixing, can be substantially completely baked-out, and has substantially no spectral sensitivity beyond 550 nm so that the screening process may be carried out in yellow light, rather than in the dark, in order to provide a safe working environment without deleterious effects on the panels coated with the novel photoconductive layer.
摘要:
The invention relates to a method of electrophotographically manufacturing a luminescent screen assembly for a color CRT by utilizing materials whose volatilizable constituents are substantially completely baked-out in the same step in which the faceplate panel is frit sealed to the funnel of the tube envelope. This method eliminates a dedicated panel bake before frit sealing of the panel to the funnel.
摘要:
The method of electrophotographically manufacturing a screen assembly on an interior surface of a faceplate panel for a color CRT, according to the present invention, includes the steps of sequentially coating the surface of the panel with a conductive solution to form a volatilizable organic conductive layer and then overcoating the conductive layer with a photoconductive solution to form a volatilizable organic photoconductive layer. The conductive layer, comprising a quaternary ammonium polyelectrolyte and a surfactant, provides an electrode for the photoconductive layer and has improved electrical and physical properties compared to prior conductive layers.