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公开(公告)号:US08825444B1
公开(公告)日:2014-09-02
申请号:US12555721
申请日:2009-09-08
CPC分类号: G06F11/3409 , G05B23/024
摘要: A metrology unit includes an integrated reference target with which an automated system check process is performed. The automated system check process includes measuring a feature on the reference target and determining if the measurement is within a desired specification for the metrology unit. When the metrology unit fails the automated system check, or if otherwise warranted, an automated diagnosis process may be performed using the same integrated reference target. The automated system check and automated diagnosis may be optimized based on correlations between parameters of the automated qualification and parameters of the automated diagnosis. Similarly, the measurement of a processed wafer may be optimized based on a correlation between parameters of the metrology of the processed wafer and parameters of the automated system check.
摘要翻译: 计量单元包括执行自动化系统检查过程的集成参考目标。 自动化系统检查过程包括测量参考目标上的特征并确定测量是否在度量单元的期望规格内。 当计量单元故障自动化系统检查时,或者如果有其他保证,则可以使用相同的集成参考目标来执行自动诊断过程。 可以基于自动化鉴定的参数和自动诊断的参数之间的相关性来优化自动化系统检查和自动诊断。 类似地,可以基于处理的晶片的度量的参数和自动化系统检查的参数之间的相关性来优化处理的晶片的测量。