摘要:
A metrology unit includes an integrated reference target with which an automated system check process is performed. The automated system check process includes measuring a feature on the reference target and determining if the measurement is within a desired specification for the metrology unit. When the metrology unit fails the automated system check, or if otherwise warranted, an automated diagnosis process may be performed using the same integrated reference target. The automated system check and automated diagnosis may be optimized based on correlations between parameters of the automated qualification and parameters of the automated diagnosis. Similarly, the measurement of a processed wafer may be optimized based on a correlation between parameters of the metrology of the processed wafer and parameters of the automated system check.
摘要:
A metrology instrument includes an eddy current sensor that is mounted to and concentric with a confocal distance sensor. By measuring the precise vertical placement of the eddy current probe with respect to the surface of the sample using the confocal distance sensor, the accuracy and precision of the eddy current measurement is improved. Because the confocal distance sensor and the eddy current sensor are confocal, there is no need to move the relative lateral positions between the sample and instrument, between the distance measurement and the eddy current measurement, thereby reducing error in the measurement as well are maximizing the throughput by minimizing the required stage travel for a single measurement.
摘要:
An ellipsometer with a variable retarder, which introduces a spatial dependence in the beam, includes a polarizing beam splitter to produce two beams with orthogonal polarization states. The beam splitter may be, e.g., a polarizing displacer or polarizing beam splitter. The intensities of the two beams are measured, e.g., using separate detectors or separate detector elements in an array. The intensity from the two beams may be summed and used as a reference to normalize intensity of the produced beam.
摘要:
The thickness of a thin conductive film is accurately measured without direct knowledge of the temperature of the sample. A coulometer measurement during deposition of the conductive film on a substrate, along with other data such as the plated surface area, the electrochemical reaction, the molar volume of the deposited metal and the coulombic efficiency, is used to determine the average thickness of the film. Eddy current measurements yield the sheet resistance of the film at a plurality of locations, from which the average sheet resistance can be determined. The eddy current measurements are made so as to reduce the effects of any temperature change in the sample. The average thickness and the average sheet resistance yield the average resistivity of the film. The thickness of the film at a measurement location can be calculated using that average resistivity and the sheet resistance measurement at that location.
摘要:
A profiling method compensates for phase changes associated with the presence of multiple or varying material in the area to be measured. The profiling method measures at least a portion of the height profile of the area of interest. The phase of the different materials in the region are also obtained and used to generate a correction factor. Depending on the type of material in the region of interest, the correction factor may be the material specific phase difference of the materials in the region, e g., when at least one of the materials is opaque to the wavelength of light used to measure the height profile, or the relationship between the thickness and phase of the material for a desired thickness range, e.g., when one or more of the materials is transparent to the wavelengths used to measure the height profile. The correction factor is then used to correct and/or convert the measured phase profile to an actual height profile. Accordingly, an accurate height profile may be obtained for regions that include dishing, erosion, or that contain various types of materials.
摘要:
A confocal displacement sensor uses one or two light sources and produces two spots on a sample surface. The reflected intensities from the two spots are detected and measured by one or two detectors. A vertical resolution enhancement can be implemented by modifying the properties of the objective and/or detector lenses. The resultant height profile does not need to be corrected for tilt as is common with all single point surface measurement techniques. A differential scan can be performed with the two spots relatively close together to generate the slope of the height profile. Integrating this profile yields the height profile of the scan. A referential scan can be performed by scanning the reference point across an area of constant height and the measurement point scanned across the feature to be measured to directly generate the height profile.
摘要:
A time delayed differential weighing procedure used with an electronic analytical balance is optimized for samples exhibiting a small change in mass, for example from deposition, etching, plating or corroding, relative to the sample mass to minimize all significant sources of error that could otherwise degrade the measurement results, such as errors resulting from air density and temperature changes that occur during the interval between the first measurement of a sample, before the sample is processed, and a subsequent measurement of the sample, after the sample is processed. A calibration standard having substantially the same density as that of the sample is weighed both times the sample is weighed, i.e. before and after processing, to track the change in the sample balance reading due to air density and temperature changes, and thereby eliminate sample related errors. Balance and weighing procedure accuracy and precision are tested by a gauge study procedure. A procedure for determining area exposed after photoresist develop on a semiconductor wafer application is also provided.
摘要:
A chuck, which may hold a substrate during stress measurements, includes a number of pins that support the substrate. Each support pin has a dome shaped upper surface that contacts a bottom surface of a substrate when supporting the substrate. The dome shaped upper surface minimizes contact with the substrate as well as assists in maintaining the same contact location with the substrate regardless of substrate shape. The dome shaped upper surface may be formed of a layer of soft material having a high coefficient of static friction to hold the substrate stationary with respect to the pins when the chuck is accelerated moved during or between stress measurements. Additionally, the layer of soft material may be a thin layer that covers a hard internal dome to reduce creep.
摘要:
A metrology process, in accordance with the present invention, measures the dishing of a first feature made of a first material by determining the relative height of the first feature with respect to a second feature, where the first and second features have different dishing rates. The relative height of the first feature with respect to the second feature may be determined by measuring a first relative height of the first feature with respect to a reference location, measuring a second relative height of the second feature with respect to a reference location, and calculating the difference between the first and second relative heights. Alternatively, other methods may be used. The relative height is then correlated with calibration data to determine the amount of dishing of the first feature. The calibration data is generated by first providing a sample substrate with features approximately the same as the substrate to be measured, e.g., first and second calibration features of similar dishing rates as first and second features on a production substrate. The sample substrate is then processed to produce dishing of the first and second calibration features. Subsequently, the actual dishing of the first and second calibration features is measured, and the difference in dishing between the first and second calibration features calculated. The calibration data is then produced by relating the difference in dishing between the first and second calibration features to the actual dishing of the first calibration feature.
摘要:
Lithium-based cells are promising for applications such as electric vehicles and load-leveling for power plants since lithium is very electropositive and light weight. One type of lithium-based cell utilizes a molten salt electrolyte and is operated in the temperature range of about 400.degree.-500.degree. C. Such high temperature operation accelerates corrosion problems and a substantial amount of energy is lost through heat transfer. The present invention provides an electrochemical cell (10) which may be operated at temperatures between about 100.degree.-170.degree. C. Cell (10) comprises an electrolyte (16), which preferably includes lithium nitrate, and a lithium or lithium alloy electrode (12).