公开(公告)号：US07046535B2

公开(公告)日：2006-05-16

申请号：US11003542

申请日：2004-12-03

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07289343B2

公开(公告)日：2007-10-30

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US07180763B2

公开(公告)日：2007-02-20

申请号：US10945850

申请日：2004-09-21

申请人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02M1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US07292451B2

公开(公告)日：2007-11-06

申请号：US11010950

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H01R9/00

CPC分类号： H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07301755B2

公开(公告)日：2007-11-27

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02H7/122 ,  H05K7/20

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US20060062023A1

公开(公告)日：2006-03-23

申请号：US10945850

申请日：2004-09-21

申请人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02J1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US20050162875A1

公开(公告)日：2005-07-28

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US20050152100A1

公开(公告)日：2005-07-14

申请号：US11003542

申请日：2004-12-03

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00 ,  H02B5/00 ,  H02M7/00 ,  H05K7/14

CPC分类号： H05K7/1432 ,  H02M7/003 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US20050152101A1

公开(公告)日：2005-07-14

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02B5/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US20060007721A1

公开(公告)日：2006-01-12

申请号：US11010950

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。