公开(公告)号：US20240213207A1

公开(公告)日：2024-06-27

申请号：US18555670

申请日：2022-04-25

申请人： Panasonic Holdings Corporation

发明人： Masato MAEDE ,  Hideki NIIMI ,  Hidetoshi KITAURA

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L23/495 ,  H01L25/07

CPC分类号： H01L24/32 ,  H01L23/49548 ,  H01L24/27 ,  H01L25/072 ,  H01L23/367 ,  H01L2224/27505 ,  H01L2224/32245 ,  H01L2924/13055

摘要： A semiconductor module comprises a semiconductor element, a joining part configured including a sintered metal, a substrate member, and a lead frame. The joining part comprises: at least one element joining member that joins the semiconductor element and a main surface of the substrate member; and at least one lead frame joining member that joins the lead frame and the main surface of the substrate part, the at least one lead frame joining member having a small-piece form with the same volume as the element joining member.