公开(公告)号：US20230200036A1

公开(公告)日：2023-06-22

申请号：US17999409

申请日：2021-05-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshinori ISOBATA ,  Kunimi TSUZURUGI ,  Tatsuo YAMAMURA ,  Kyourei RI ,  Chikara TAKATA ,  Atuyuki HORIE ,  Kazunari MISHIMA ,  Minoru KITANI ,  Kazunori KANAI ,  Yasuo OKU ,  Hiroaki KATO

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K13/0452 ,  H05K13/0419 ,  H05K13/086

Abstract: The component mounting device includes a component supply part on which a component supply unit that supplies a component stored in a carrier tape is detachably mounted; a feeder information acquisition part that acquires feeder information including a type of the component supply unit mounted on the component supply part; a component mounting part that mounts the component supplied from the component supply unit onto a substrate; and a unit controller that controls the component supply unit based on the feeder information.

公开(公告)号：US20220132713A1

公开(公告)日：2022-04-28

申请号：US17427387

申请日：2020-01-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshinori ISOBATA ,  Atuyuki HORIE

IPC: H05K13/04 ,  B65H23/00 ,  B65H20/02

Abstract: The component feeding device includes a body portion, a first sprocket, a second sprocket, a peeler, a pair of rollers, and an openable cover. The first sprocket transports the carrier tape to the downstream component pickup position. The second sprocket transports the carrier tape from the component pickup position to the discharge port. The pair of rollers discharges the cover tape peeled off at the peeler. The first sprocket, the second sprocket, and the pair of rollers are disposed below the openable cover.

公开(公告)号：US20190055101A1

公开(公告)日：2019-02-21

申请号：US16055520

申请日：2018-08-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Atuyuki HORIE

IPC: B65H20/20 ,  H05K13/04 ,  B65H37/00

CPC classification number: B65H20/20 ,  B32B38/10 ,  B32B43/006 ,  B65H37/002 ,  B65H2301/4481 ,  B65H2301/51115 ,  B65H2301/51122 ,  B65H2404/147 ,  B65H2404/7414 ,  B65H2406/122 ,  B65H2701/1311 ,  H05K13/0419 ,  Y10T156/1137 ,  Y10T156/1174 ,  Y10T156/1939 ,  Y10T156/1956

Abstract: There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that peels off the cover tape from the carrier tape via an opening portion disposed above the transport path; and a cover that makes an open state of the opening portion variable. The cover sets the open state of the opening portion to be any of a first open state allowing the peeler to capture the cover tape and a second open state where an opening size of the opening portion is smaller than that of the first open state and passage of the cover tape peeled off from the carrier tape is not impeded.