公开(公告)号：US20180108558A1

公开(公告)日：2018-04-19

申请号：US15534196

申请日：2015-07-16

申请人： Zhejiang Microtech Material Co., Ltd.

发明人： Ming YIN ,  Hao TANG

IPC分类号： H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  B32B43/00

CPC分类号： H01L21/6835 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/67253 ,  H01L21/681 ,  H01L21/6838 ,  H01L21/68714 ,  H01L2221/68381 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1158 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1939 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

摘要： A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.

公开(公告)号：US09764488B2

公开(公告)日：2017-09-19

申请号：US14468801

申请日：2014-08-26

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Ryu Komatsu ,  Kohei Yokoyama ,  Masakatsu Ohno ,  Satoru Idojiri ,  Hisao Ikeda ,  Yasuhiro Jinbo ,  Hiroki Adachi ,  Yoshiharu Hirakata ,  Shingo Eguchi ,  Daiki Nakamura

IPC分类号： C03B33/027 ,  C03B33/07 ,  B26D3/08 ,  G02F1/13 ,  B26D3/28 ,  B26F1/38 ,  C03B33/037

CPC分类号： B26D3/282 ,  B26D3/08 ,  B26F1/3826 ,  C03B33/027 ,  C03B33/037 ,  C03B33/07 ,  G02F1/1303 ,  Y02P40/57 ,  Y10T83/0281 ,  Y10T156/1051 ,  Y10T156/1082 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1195 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T156/1788 ,  Y10T156/1793 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1939 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1994

摘要： A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

公开(公告)号：US20160361912A1

公开(公告)日：2016-12-15

申请号：US14735488

申请日：2015-06-10

申请人： Cardinal IG Company

发明人： Curtis Lee Queck ,  Robert Casper Buchanan ,  Michael John Milewski ,  Jacobus P. Pretorius

IPC分类号： B32B43/00 ,  B32B37/10 ,  B32B37/14

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2607/00 ,  Y10T83/808 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

摘要： The invention provides machines for removing strips of masking from glazing panes. Also provided are methods of removing strips of masking from glazing panes.

摘要翻译： 本发明提供了用于从玻璃窗中去除掩蔽条的机器。 还提供了从玻璃窗中去除掩蔽条的方法。

公开(公告)号：US20160332436A1

公开(公告)日：2016-11-17

申请号：US14797124

申请日：2015-07-11

申请人： Hao Tang ,  Yushen Zeng

发明人： Hao Tang ,  Yushen Zeng

IPC分类号： B32B43/00 ,  B32B37/06 ,  B32B38/10

CPC分类号： B32B43/006 ,  B32B37/06 ,  B32B38/10 ,  B32B2457/14 ,  H01L21/67092 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1939 ,  Y10T156/1967

摘要： The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.

摘要翻译： 本发明提供了一种利用气体射流产生的力分离粘合的叠层的方法。 堆叠包括载体和诸如器件晶片的薄化工件，其通过它们之间的一个或多个层结合在一起。 气体射流可以分离其间具有0.01至50.0g / cm 3范围内的剥离强度的两个相邻层。 本发明可以简化程序并提供从其载体分离薄化晶片的高产量。

公开(公告)号：US09358770B2

公开(公告)日：2016-06-07

申请号：US14265577

申请日：2014-04-30

申请人： The Boeing Company

发明人： Shuonan Dong ,  Byungwoo Lee ,  David J Heiser ,  Miles Stefanovski ,  Matthew J O'Brien ,  Kevin S Callahan ,  Derek J Flolid

IPC分类号： B32B38/10 ,  B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B43/00 ,  B32B2605/18 ,  Y10T156/11 ,  Y10T156/1137 ,  Y10T156/1142 ,  Y10T156/1179 ,  Y10T156/1195 ,  Y10T156/19 ,  Y10T156/1939 ,  Y10T156/1978 ,  Y10T156/1983 ,  Y10T156/1994

摘要： A method for initial separation of an adhered backing film from an uncured pre-impregnated composite lamina having an edge includes exposing and supporting the edge of the composite lamina, and applying an impact force to the exposed edge with an automated tool. The impact force is sufficient to cause delamination of the backing film from the composite lamina without damaging the lamina.

摘要翻译： 用于从具有边缘的未固化的预浸渍复合材料薄层初始分离粘附的背衬膜的方法包括暴露和支撑复合层的边缘，并用自动化工具对暴露的边缘施加冲击力。 冲击力足以使背衬薄膜从复合薄片分层而不会损坏薄片。

公开(公告)号：US09281403B2

公开(公告)日：2016-03-08

申请号：US14207759

申请日：2014-03-13

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Toru Takayama ,  Junya Maruyama ,  Shunpei Yamazaki

IPC分类号： H01L27/12 ,  H01L29/66 ,  H01L29/786 ,  B32B7/06 ,  B32B43/00 ,  H01L21/762 ,  H01L51/00 ,  G02F1/136 ,  H01L21/322 ,  H01L27/32 ,  H01L51/52

CPC分类号： H01L27/1266 ,  B32B7/06 ,  B32B43/006 ,  B32B2310/0843 ,  B32B2457/08 ,  B32B2457/14 ,  G02F1/1368 ,  G02F2001/13613 ,  H01L21/3221 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/3244 ,  H01L27/3246 ,  H01L27/3248 ,  H01L27/3258 ,  H01L29/6675 ,  H01L29/66757 ,  H01L29/78663 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/529 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  Y10S438/977 ,  Y10T156/1137 ,  Y10T156/1939

摘要： There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.

公开(公告)号：US09242414B2

公开(公告)日：2016-01-26

申请号：US13936298

申请日：2013-07-08

申请人： Kyung-Hyun Ahn ,  Jin-Han Park ,  Dong-Sul Kim ,  Byung-Chul Lee

发明人： Kyung-Hyun Ahn ,  Jin-Han Park ,  Dong-Sul Kim ,  Byung-Chul Lee

IPC分类号： B32B38/10 ,  B29C69/00 ,  B32B43/00

CPC分类号： B29C69/006 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1174 ,  Y10T156/1939 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

摘要翻译： 一种分层装置，其包括下部支撑体，设置在下部支撑体上的受主基板和沿着受主基板的边缘与下部支撑体层叠的供体膜，在其间插入受体基板的阶段。 分层装置还包括设置在台架的端侧的第一夹持器，通过夹持施主膜的端部将施主膜的端部移动到远离受主基板的方向; 以及第一剥离辊，其设置在供体膜上以支撑设置在受主基板和第一夹持器之间的供体膜，并且将其自身旋转到第一夹持器的方向。

公开(公告)号：US08997822B2

公开(公告)日：2015-04-07

申请号：US13979549

申请日：2012-01-12

申请人： Yasuharu Iwashita ,  Osamu Hirakawa ,  Masaru Honda ,  Akira Fukutomi

发明人： Yasuharu Iwashita ,  Osamu Hirakawa ,  Masaru Honda ,  Akira Fukutomi

IPC分类号： B32B38/10 ,  H01L21/67 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67011 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1939 ,  Y10T156/1944 ,  Y10T156/195

摘要： According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

摘要翻译： 根据本公开的实施例，提供了用于反转基板的前表面和后表面的基板反转装置。 基板包括：第一保持单元，被配置为保持基板的一个表面;以及第二保持单元，设置成面对第一保持单元并且构造成保持基板的一个表面。 此外，基板包括移动机构，该移动机构构造成相对移动第一保持单元和第二保持单元中的至少一个，以彼此接近并保持彼此间隔开;以及传送机构，其构造成保持基板的一个表面 。 在这种情况下，由伯努利卡盘执行第一保持单元，第二保持单元和转印机构中的基板的支撑。

公开(公告)号：US08701734B2

公开(公告)日：2014-04-22

申请号：US12453816

申请日：2009-05-22

申请人： Akihiko Nakamura

发明人： Akihiko Nakamura

IPC分类号： B32B38/10 ,  H01L21/687

CPC分类号： H01L21/68728 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1939 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

摘要： A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

摘要翻译： 根据本发明的分离装置包括夹持支撑板的外周端的夹具。 夹具夹持支撑板的外周端，并通过夹持支撑板将支撑板与晶片分离。 这使得可以在不破坏晶片的情况下将支撑板与晶片分离。 由此，支撑板可以与已经安装支撑板的晶片分离，而不会破坏晶片。

公开(公告)号：US20130269879A1

公开(公告)日：2013-10-17

申请号：US13977134

申请日：2011-12-16

申请人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda

发明人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B37/06 ,  B32B38/10 ,  B32B41/00 ,  B32B2309/68 ,  B32B2310/0472 ,  B32B2457/14 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/68728 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1939 ,  Y10T156/1972

摘要： A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

摘要翻译： 一种用于从重叠的基板剥离待处理的基板和支撑基板的剥离装置，所述重叠的基板通过粘合剂将待处理的基板和所述支撑基板接合而形成，所述粘合剂包括：第一保持单元， 被处理并被构造成保持待处理的基板的基板; 第二保持单元，被配置为加热所述支撑基板并且构造成保持所述支撑基板; 移动机构，被配置为相对于彼此水平移动所述第一保持单元和所述第二保持单元中的至少一个; 以及惰性气体供给机构，其构造成将惰性气体供给到被处理基板的接合面或支撑基板的接合面。