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公开(公告)号:US10806060B2
公开(公告)日:2020-10-13
申请号:US16683426
申请日:2019-11-14
Inventor: Atuyuki Horie
Abstract: There is provided a component supply device for supplying a component to a component mounter, including; a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that is disposed above the transport path and peels off the cover tape from the carrier tape; and an ejector that ejects a gas for capturing the cover tape by the peeler.
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公开(公告)号:USD993200S1
公开(公告)日:2023-07-25
申请号:US29748838
申请日:2020-09-01
Designer: Atuyuki Horie , Chikara Takata , Yoshinori Isobata
Abstract: FIG. 1 is a front perspective view of a tape feeder according to the invention;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design.-
公开(公告)号:USD1055150S1
公开(公告)日:2024-12-24
申请号:US29838606
申请日:2022-05-13
Designer: Yoshinori Isobata , Minoru Kitani , Satoshi Kawaguchi , Atuyuki Horie , Chikara Takata
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公开(公告)号:US10517200B2
公开(公告)日:2019-12-24
申请号:US16055502
申请日:2018-08-06
Inventor: Atuyuki Horie
Abstract: There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that is disposed above the transport path and peels off the cover tape from the carrier tape; and an ejector that ejects a gas for capturing the cover tape by the peeler.
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公开(公告)号:US10414612B2
公开(公告)日:2019-09-17
申请号:US16055520
申请日:2018-08-06
Inventor: Atuyuki Horie
Abstract: There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that peels off the cover tape from the carrier tape via an opening portion disposed above the transport path; and a cover that makes an open state of the opening portion variable. The cover sets the open state of the opening portion to be any of a first open state allowing the peeler to capture the cover tape and a second open state where an opening size of the opening portion is smaller than that of the first open state and passage of the cover tape peeled off from the carrier tape is not impeded.
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公开(公告)号:USD1055122S1
公开(公告)日:2024-12-24
申请号:US29918444
申请日:2023-11-28
Designer: Yoshinori Isobata , Minoru Kitani , Satoshi Kawaguchi , Atuyuki Horie , Chikara Takata
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公开(公告)号:US12162717B2
公开(公告)日:2024-12-10
申请号:US17427663
申请日:2020-01-27
Inventor: Yoshinori Isobata , Atuyuki Horie , Chikara Takata , Kunimi Tsuzurugi , Kazunari Mishima , Kyourei Ri , Minoru Kitani , Tatsuo Yamamura
Abstract: The component supply device includes a body, a first carrier tape transporter, a second carrier tape transporter, and a controller. The body includes a tape transport path. The first carrier tape transporter transports a carrier tape to a component pickup position. The second carrier tape transporter transports the carrier tape to the first carrier tape transporter. The controller is configured to communicate with the component installation device and control the first carrier tape transporter and the second carrier tape transporter in one operation mode selected from a plurality of operation modes.
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