公开(公告)号：US11293626B2

公开(公告)日：2022-04-05

申请号：US16247748

申请日：2019-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideaki Katou ,  Koji Sakurai ,  Masanori Ikeda ,  Naoki Azuma

IPC: F21V19/00 ,  H05K13/04 ,  H05K13/08 ,  F21V14/02 ,  G01D5/26 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H05K13/00

Abstract: A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.

公开(公告)号：US11991831B2

公开(公告)日：2024-05-21

申请号：US17755223

申请日：2020-08-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideaki Katou ,  Naoki Azuma ,  Koji Sakurai ,  Masanori Ikeda

IPC: H05K13/04 ,  H05K13/00

CPC classification number: H05K13/0015 ,  H05K13/04

Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.