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公开(公告)号:US20240206142A1
公开(公告)日:2024-06-20
申请号:US18591145
申请日:2024-02-29
Inventor: Tetsushi OHORI , Takashi UCHINO , Hiroki YAMAMOTO
IPC: H05K13/00 , B66F9/06 , G05B19/418
CPC classification number: H05K13/0084 , B66F9/063 , G05B19/41865 , H05K13/0015 , G05B2219/50393
Abstract: A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle transfers the feeder carriage to a position where an operation of connecting the feeder carriage to the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a connection completion indicating that a connection of the feeder carriage is completed. The mounting system includes a second processor which causes the connection mechanism to connect the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the connection completion upon being informed of completion of the connection.
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公开(公告)号:US20240147616A1
公开(公告)日:2024-05-02
申请号:US18496935
申请日:2023-10-30
Applicant: NACHI-FUJIKOSHI CORP.
Inventor: Akira KUNISAKI , Shun SASAKI
CPC classification number: H05K1/0393 , H05K13/0015 , H05K13/0408 , H05K13/046 , H05K2201/10356
Abstract: In an electronic device assembly apparatus that inserts a leading end of flat and flexible cables 162 and 166 into connectors 164 and 168 on a circuit board 160, a gripping device 200 includes a first gripping mechanism 210 and a second gripping mechanism 212, a rotational mechanism 260, and a width direction open/close mechanism 240, and the width direction open/close mechanism 240 includes a first cylinder 244 and a second cylinder 270 that causes the first and the second gripping mechanism to perform a width adjustment movement in the same direction as the first cylinder, and the second cylinder has a lock function for fixing the second cylinder at a predetermined position.
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公开(公告)号:US20240126963A1
公开(公告)日:2024-04-18
申请号:US18399436
申请日:2023-12-28
Applicant: BOARDERA SOFTWARE INC.
Inventor: Curtis Hunter , David Workman
IPC: G06F30/31 , G06F30/392 , H05K3/00
CPC classification number: G06F30/31 , G06F30/392 , H05K3/0005 , H05K13/0015
Abstract: An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.
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公开(公告)号:US11930599B2
公开(公告)日:2024-03-12
申请号:US16982811
申请日:2018-03-22
Applicant: FUJI CORPORATION
Inventor: Kazumi Hoshikawa , Hiroshi Murakami
CPC classification number: H05K13/08 , H05K13/0015 , H05K13/0061 , H05K13/04
Abstract: A constitutive device quality determination server is communicably connected to an inspection device via the internet, the inspection device performing an inspection on a constitutive device configuring a board work machine by operating the constitutive device in accordance with to a type of the inspection, and includes an inspection data acquisition section that designates a predetermined type of the inspection for the inspection device and acquires inspection data obtained by the inspection by the inspection device, a determination section that determines quality of the constitutive device based on the acquired inspection data, and a transmission section that transmits a quality determination result determined by the determination section to a terminal device communicably connected over the internet.
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公开(公告)号:US11900033B2
公开(公告)日:2024-02-13
申请号:US17485634
申请日:2021-09-27
Applicant: BOARDERA SOFTWARE INC.
Inventor: Curtis Hunter , David Workman
IPC: G06F30/30 , H05K3/00 , G06F30/31 , G06F30/392 , H05K13/00 , G06F115/12
CPC classification number: G06F30/31 , G06F30/392 , H05K3/0005 , G06F2115/12 , H05K13/0015
Abstract: An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.
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公开(公告)号:US11856705B2
公开(公告)日:2023-12-26
申请号:US17753900
申请日:2020-09-01
Applicant: Muehlbauer GmbH & Co. KG
Inventor: Stefan Feigl , Siarhei Lakhadanau
CPC classification number: H05K13/0413 , H05K13/0015 , H05K13/041 , H05K13/0812
Abstract: A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.
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公开(公告)号:US11778795B2
公开(公告)日:2023-10-03
申请号:US16759582
申请日:2017-11-17
Applicant: FUJI CORPORATION
Inventor: Nobuyuki Ishikawa
IPC: H05K13/00 , H05K13/04 , G05B19/418 , G05B19/4155
CPC classification number: H05K13/0015 , G05B19/4155 , G05B19/41805 , H05K13/0411 , G05B2219/45026
Abstract: A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.
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公开(公告)号:US20230262949A1
公开(公告)日:2023-08-17
申请号:US17942865
申请日:2022-09-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoshik HAN , Youngwook Kwon , Bongho Suk , Kangho Kim , Myeonggu Kim , Seungjong Yu , Changwoo Yu , Youngmin Cho
CPC classification number: H05K13/0015 , B23Q3/186 , H05K13/0409 , H01L33/005
Abstract: According to various embodiments of the disclosure, an aligning device may include a body part including a body and a mask plate, wherein the body is configured to receive a movement by a first moving part and includes a body hole and the mask plate is configured to receive a movement by a second moving part and includes a mask plate hole and a head part disposed on the body part and configured to receive a movement by a third moving part. The mask plate may be disposed between the body and the head part and is configured to receive the movement by the second moving part to move between the body and the head part.
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公开(公告)号:US20190242558A1
公开(公告)日:2019-08-08
申请号:US16247748
申请日:2019-01-15
Inventor: HIDEAKI KATOU , KOJI SAKURAI , MASANORI IKEDA , NAOKI AZUMA
CPC classification number: F21V19/0025 , F21V14/02 , G01D5/26 , H01L25/0753 , H01L27/156 , H01L33/005 , H05K13/0015
Abstract: A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.
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公开(公告)号:US10060683B2
公开(公告)日:2018-08-28
申请号:US15079602
申请日:2016-03-24
Inventor: Yu-Chung Huang , Chen-Hui Chung
IPC: F28F7/00 , H05K7/20 , H05K7/02 , H05K7/04 , F28F9/007 , F28D21/00 , F28F3/02 , H05K13/00 , H01L23/40 , H05K1/02
CPC classification number: F28F9/0075 , F28D21/00 , F28D2021/0029 , F28F3/02 , F28F2280/04 , H01L23/40 , H01L2023/4062 , H01L2023/4087 , H05K1/0203 , H05K13/0015 , H05K13/0447
Abstract: An apparatus for positioning a heat sink includes a base plate, two support assemblies and a mounting assembly. The base plate placed on a circuit board has an opening. The two support assemblies are disposed on two opposing sides of the opening respectively, and exposed partly to the opening for supporting a heat sink thereon. The mounting assembly includes a frame and a positioning member. The frame contacts the support assembly, and the positioning member is fixed on the frame. When the mounting assemblies move in a preset direction, the positioning member engages the heat sink, and the support assemblies would be retrieved from the opening, whereby the heat sink would be lowered to the heat sink setting area via the opening.
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