公开(公告)号：US10297516B2

公开(公告)日：2019-05-21

申请号：US15746013

申请日：2017-03-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masayuki Nagamatsu ,  Shinya Marumo ,  Junichi Kimura ,  Tatsuya Kunisato ,  Ryosuke Usui

IPC: H01L23/12 ,  H01L23/28 ,  H01L23/48 ,  H01L23/50 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove.

公开(公告)号：US10211144B2

公开(公告)日：2019-02-19

申请号：US15580457

申请日：2016-07-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shinichi Kohda ,  Junichi Kimura ,  Ryosuke Usui ,  Tomohide Ogura ,  Atsushi Watanabe

IPC: H01L23/50 ,  H01L23/36 ,  H01L23/49 ,  H01L23/58 ,  H01L23/48 ,  H05K7/20 ,  H01L23/00 ,  H01L23/495

Abstract: This semiconductor device includes a semiconductor element mounted on a metal layer, first to third connection terminals that are provided on the semiconductor element, a first bus bar bonded to the first connection terminal, and a second bus bar bonded to the second connection terminal. The semiconductor element is bonded to the metal layer, and the first to third connection terminals are disposed on a top surface of the semiconductor element. One end of the first bus bar is bonded to the first connection terminal, another end of the first bus bar is an output unit, one end of the second bus bar is bonded to the second connection terminal, and another end of the second bus bar is bonded to the metal layer. A first surface of the semiconductor element and the second bus bar are at an identical potential.