公开(公告)号：US11443883B2

公开(公告)日：2022-09-13

申请号：US16768903

申请日：2018-12-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takeshi Fujii ,  Ryosuke Usui ,  Chihiro Satou

IPC: H01F27/22 ,  H01F27/24 ,  H01F27/32 ,  H01F41/12

Abstract: A reactor device includes a coil, a magnetic core having the coil thereon, a case accommodating the coil and the magnetic core, a cooling plate fixed to the case, an insulating sheet disposed between the coil and the cooling plate, a compressible graphite sheet disposed between the coil and the cooling plate, and a screw to fix the cooling plate to the case. The case has a screw hole and an opening provided therein. The screw passes through the screw hole to fix the cooling plate to the case. The coil contacts the insulating sheet through the opening of the case. The graphite sheet contacts the cooling plate. The reactor has high cooling performance and reliability.

公开(公告)号：US11387023B2

公开(公告)日：2022-07-12

申请号：US16622572

申请日：2018-09-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ken Yanai ,  Tomokazu Yamaguchi ,  Yuji Yamagishi ,  Naoki Mutou ,  Sayaka Matsumoto ,  Ryosuke Usui

IPC: H01G7/00 ,  H01C17/30 ,  H01C7/10 ,  H01C7/18 ,  H01C17/28

Abstract: A sintered body that includes ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

公开(公告)号：US11384892B2

公开(公告)日：2022-07-12

申请号：US16769274

申请日：2018-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuuichi Abe ,  Chihiro Satou ,  Ryosuke Usui

IPC: F16L59/02 ,  B32B3/30 ,  D06M11/79

Abstract: A heat insulation sheet includes a fiber sheet having spaces therein and a silica xerogel held in the spaces of the fiber sheet. The heat insulation sheet includes a thick region and a low compressible region thinner than the thick region. A compressibility of the low compressible region is equal to smaller than 5% upon having a pressure of 0.7 MPa applied to the low compressible region. This heat insulation sheet is superior in electrical insulation properties and thermal insulation properties, and secures a predetermined distance even in a case that the heat insulation sheet receives pressures from the both sides thereof, thus providing equipment with reliability.

公开(公告)号：US10297516B2

公开(公告)日：2019-05-21

申请号：US15746013

申请日：2017-03-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masayuki Nagamatsu ,  Shinya Marumo ,  Junichi Kimura ,  Tatsuya Kunisato ,  Ryosuke Usui

IPC: H01L23/12 ,  H01L23/28 ,  H01L23/48 ,  H01L23/50 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove.

公开(公告)号：US10211144B2

公开(公告)日：2019-02-19

申请号：US15580457

申请日：2016-07-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shinichi Kohda ,  Junichi Kimura ,  Ryosuke Usui ,  Tomohide Ogura ,  Atsushi Watanabe

IPC: H01L23/50 ,  H01L23/36 ,  H01L23/49 ,  H01L23/58 ,  H01L23/48 ,  H05K7/20 ,  H01L23/00 ,  H01L23/495

Abstract: This semiconductor device includes a semiconductor element mounted on a metal layer, first to third connection terminals that are provided on the semiconductor element, a first bus bar bonded to the first connection terminal, and a second bus bar bonded to the second connection terminal. The semiconductor element is bonded to the metal layer, and the first to third connection terminals are disposed on a top surface of the semiconductor element. One end of the first bus bar is bonded to the first connection terminal, another end of the first bus bar is an output unit, one end of the second bus bar is bonded to the second connection terminal, and another end of the second bus bar is bonded to the metal layer. A first surface of the semiconductor element and the second bus bar are at an identical potential.

公开(公告)号：US10453776B2

公开(公告)日：2019-10-22

申请号：US15196153

申请日：2016-06-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryosuke Usui ,  Tetsuzo Ueda

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/473 ,  H01L23/495 ,  H02M7/48 ,  H01L23/053 ,  H01L23/528 ,  H01L49/02 ,  H05K7/20

Abstract: A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.