公开(公告)号：US20220088709A1

公开(公告)日：2022-03-24

申请号：US17541166

申请日：2021-12-02

Applicant: Panasonic Intellectual Property Management Co, Ltd.

Inventor： JINGBO WANG ,  MASATOSHI NISHIO ,  KENZO SHIBATA ,  MANABU NISHIHARA

IPC: B23K26/21

Abstract: Laser welding device (1000) includes: laser oscillator (100); optical fiber (300) that transmits a laser beam (LB) generated in laser oscillator (100); laser beam emitting head (400) that is attached to the emission end of optical fiber (300) and emits laser beam (LB) toward workpiece (600); manipulator (500) with laser beam emitting head (400) attached thereto; and controller (200) that controls laser beam emitting head (400) so as to cause laser beam (LB) to be scanned three-dimensionally on the surface of workpiece (600). Controller (200) controls laser beam emitting head (400) so as to change a focal position of laser beam (LB) in accordance with a shape of a welded portion in workpiece (600).

公开(公告)号：US20220072661A1

公开(公告)日：2022-03-10

申请号：US17527453

申请日：2021-11-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  MASATOSHI NISHIO ,  KENZO SHIBATA ,  MANABU NISHIHARA

IPC: B23K26/384 ,  B23K26/062 ,  B23K26/064 ,  B23K26/035

Abstract: A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

公开(公告)号：US20230158606A1

公开(公告)日：2023-05-25

申请号：US18158457

申请日：2023-01-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  TSUTOMU SUGIYAMA ,  SHUNSUKE KAWAI ,  KENZO SHIBATA ,  MASASHI ISHIGURO ,  ATSUHIRO KAWAMOTO

IPC: B23K26/21 ,  B23K26/082 ,  B23K26/08

CPC classification number: B23K26/21 ,  B23K26/082 ,  B23K26/0884

Abstract: Provided is a laser welding method including a welding step of welding a workpiece by irradiating a surface of a workpiece with a laser beam that is swept two-dimensionally while being advanced in an X direction. In the welding step, the laser beam is swept to draw a predetermined pattern on the surface of the workpiece. Additionally, drawing speed and output of the laser beam are controlled to have an equal amount of heat input per unit drawing length in the predetermined pattern over the entire length of the predetermined pattern. The predetermined pattern is a continuous pattern in which two annular patterns are in contact with each other at one point.

公开(公告)号：US20220072662A1

公开(公告)日：2022-03-10

申请号：US17527495

申请日：2021-11-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  MASATOSHI NISHIO ,  KENZO SHIBATA ,  MANABU NISHIHARA

IPC: B23K26/384 ,  B23K26/062 ,  B23K26/064 ,  B23K26/035

Abstract: A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90).
Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

公开(公告)号：US20230013501A1

公开(公告)日：2023-01-19

申请号：US17935111

申请日：2022-09-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  TSUTOMU SUGIYAMA ,  SHUNSUKE KAWAI ,  KENZO SHIBATA ,  MASASHI ISHIGURO

IPC: B23K26/21

Abstract: A laser welding method includes a welding step of applying a laser beam to a surface of a workpiece while the laser beam is caused to advance in an X-direction and scanning with the laser beam is simultaneously performed in a Y-direction intersecting the X-direction. The welding step includes a first weaving step of causing the laser beam to weave in the Y-direction with first amplitude (A1), and a second weaving step of causing the laser beam to weave with a predetermined amplitude smaller than first amplitude (A1) at both end portions of a weaving trajectory drawn by the laser beam in the first weaving step.

公开(公告)号：US20220118557A1

公开(公告)日：2022-04-21

申请号：US17531291

申请日：2021-11-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  MASATOSHI NISHIO ,  KENZO SHIBATA ,  MANABU NISHIHARA

IPC: B23K26/70

Abstract: Provided is a laser processing head including: shield holder (23) that has opening (23b) formed through shield holder (23) and optical sensor mounting hole (23c) formed in an inner peripheral surface of opening (23b); optical sensor (24) that has light receiving surface (24a) facing the inside of opening (23b) through optical sensor mounting hole (23c) and is attached to shield holder (23); and second protective glass (25) that has an outer peripheral surface facing light receiving surface (24a) of optical sensor (24) and is provided in opening (23b), second protective glass (25) transmitting a laser beam emitted by a laser oscillator to emit the laser beam toward a workpiece, and second protective glass (25) including reflective coating film (25a) formed in a region in the outer peripheral surface except an opposed region facing light receiving surface (24a) of optical sensor (24).

公开(公告)号：US20240082950A1

公开(公告)日：2024-03-14

申请号：US18513665

申请日：2023-11-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JIN MATSUZAKA ,  SHUNSUKE KAWAI ,  JINGBO WANG ,  KENZO SHIBATA

IPC: B23K26/064 ,  B23K26/03

CPC classification number: B23K26/064 ,  B23K26/032

Abstract: The laser processing device includes a laser head that emits laser light and a camera that acquires a surface image of a processing member after being irradiated with the laser light. The laser processing device further includes an image processor that performs image processing on an acquired surface image and calculates a diameter of a processing mark, and an autofocus controller that derives an optimum focal position of the laser light based on the diameter of the processing mark. In addition, the laser processing device includes a driver that moves the laser head in an emission direction of the laser light to allow the laser light to be condensed at an optimum focal position based on the derivation result of the autofocus controller.

公开(公告)号：US20220072655A1

公开(公告)日：2022-03-10

申请号：US17529911

申请日：2021-11-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  MASATOSHI NISHIO ,  KENZO SHIBATA ,  MANABU NISHIHARA

IPC: B23K26/06 ,  B23K26/08 ,  B23K26/21

Abstract: A laser processing device includes a laser oscillator, first to third optical fibers, a beam control mechanism, and first to third laser light emitting heads attached to the first to third optical fibers, respectively. The beam control mechanism includes a condenser lens, first to third optical path changing mechanisms provided on an optical path of laser light LB after being transmitted through the condenser lens, and a controller that controls operations of the first to third optical path changing mechanisms. The beam control mechanism causes the laser light to be emitted from the first laser light emitting head via the selected first optical fiber.