公开(公告)号：US20250058406A1

公开(公告)日：2025-02-20

申请号：US18936774

申请日：2024-11-04

Applicant: TRELLEBORG SEALING PROFILES GERMANY GMBH

Inventor： Klaus Bergner ,  Stefan Nolte

IPC: B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/062 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/50 ,  B23K26/53 ,  B23K103/00 ,  C03C15/00 ,  G01N21/39

Abstract: The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of the application laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).

公开(公告)号：US20240367266A1

公开(公告)日：2024-11-07

申请号：US18775234

申请日：2024-07-17

Applicant: Tokyo Electron Limited

Inventor： Hayato TANOUE ,  Yohei YAMASHITA ,  Hirotoshi MORI

IPC: B23K26/53 ,  B23K26/062 ,  H01L21/304 ,  H01L21/67

Abstract: A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.

公开(公告)号：US20240173801A1

公开(公告)日：2024-05-30

申请号：US18433377

申请日：2024-02-05

Applicant: VulcanForms Inc.

Inventor： Jan Pawel Komsta ,  Alexander Dunbar ,  Matthew Sweetland

IPC: B23K26/342 ,  B22F10/36 ,  B23K26/03 ,  B23K26/062 ,  B23K26/082 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B23K26/342 ,  B22F10/36 ,  B23K26/03 ,  B23K26/062 ,  B23K26/082 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: Laser control systems and related methods for controlling arrays of lasers are disclosed. A laser control system may include a first controller configured to generate a trigger signal based on a position of a laser array, and a second controller configured to send a firing signal to one or more lasers of the laser array upon receiving the trigger signal. The one or more lasers may be selected based on a desired pattern of laser energy to be formed at a particular position of the laser array.

公开(公告)号：US11951569B2

公开(公告)日：2024-04-09

申请号：US17317977

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Ming Wu ,  Yung-Lung Lin ,  Hau-Yi Hsiao ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: H01L21/02 ,  B23K26/035 ,  B23K26/062 ,  B23K26/361 ,  H01L21/66

CPC classification number: B23K26/361 ,  B23K26/035 ,  B23K26/062 ,  H01L21/02021 ,  H01L22/10

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

公开(公告)号：US11951566B2

公开(公告)日：2024-04-09

申请号：US16527432

申请日：2019-07-31

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Christina Margaret Vasil ,  Subhrajit Roychowdhury ,  Arvind Rangarajan ,  Joshua Mook

IPC: B23K26/342 ,  B23K26/06 ,  B23K26/062 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B23K26/342 ,  B23K26/0608 ,  B23K26/062 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: A method, medium, and system to obtain an assignment of one of a plurality of different additive manufacturing (AM) print parameter sets to each of a plurality of 3D volume elements forming a representation of the model of the part; define a plurality of groupings based on margin parameter values associated with the model of the part; assign a print parameter set to each grouping; automatically assign each of the plurality of print parameter sets to a laser of a multi-laser AM device; save a record of the determined print parameter sets to laser assignments; and transmit the record of the determined print parameter sets to laser assignments to an AM controller to control the multi-laser AM device to generate the part based on the model of the part and the determined print parameter sets to laser assignments, the generated part to be built in a single build.

公开(公告)号：US20240059019A1

公开(公告)日：2024-02-22

申请号：US18221471

申请日：2023-07-13

Applicant: Velo3D, Inc.

Inventor： Erel Milshtein ,  Benyamin Buller ,  Alexander Brudny

IPC: B29C64/393 ,  B29C64/153 ,  B29C64/268 ,  B29C64/35 ,  B28B17/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K26/354 ,  B23K26/34 ,  B23K26/062 ,  B28B1/00 ,  B23K26/06 ,  B23K26/70 ,  B23K26/12 ,  B23K26/342 ,  B23K26/03 ,  B22F10/28 ,  B22F12/44 ,  B22F12/90 ,  B22F10/31 ,  B22F10/36 ,  B29C64/135

CPC classification number: B29C64/393 ,  B29C64/153 ,  B29C64/268 ,  B29C64/35 ,  B28B17/0081 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K26/354 ,  B23K26/34 ,  B23K26/062 ,  B28B1/001 ,  B23K26/0608 ,  B23K26/703 ,  B23K26/127 ,  B23K26/0604 ,  B23K26/342 ,  B23K26/125 ,  B23K26/032 ,  B22F10/28 ,  B22F12/44 ,  B22F12/90 ,  B22F10/31 ,  B22F10/36 ,  B29C64/135 ,  B22F2999/00 ,  B22F10/77

Abstract: The present disclosure provides various apparatuses, systems, software, and methods for three-dimensional (3D) printing. The disclosure delineates various optical components of the 3D printing system, their usage, and their optional calibration. The disclosure delineates calibration of one or more components of the 3D printer (e.g., the energy beam).

公开(公告)号：US11886052B2

公开(公告)日：2024-01-30

申请号：US16921531

申请日：2020-07-06

Applicant: nLIGHT, Inc.

Inventor： Dahv A. V. Kliner ,  Roger Farrow

IPC: G02F1/01 ,  G02B6/036 ,  G02B6/14 ,  B23K26/064 ,  B23K26/073 ,  G02B27/09 ,  B23K26/067 ,  B23K26/38 ,  B23K26/21 ,  B22F3/11 ,  B22F3/24 ,  B23K26/03 ,  G02B6/02 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K26/342 ,  B29C48/08 ,  G02B6/42 ,  B23K26/062 ,  B23K26/70 ,  B29C64/264 ,  B29C64/153 ,  H01S5/00 ,  B22F10/20 ,  B22F10/31 ,  B22F10/36 ,  G02B6/255 ,  G02B26/10 ,  G02B6/028 ,  G02F1/015 ,  B22F12/44 ,  B22F12/49 ,  G02B6/26 ,  G02B6/12

CPC classification number: G02F1/0115 ,  B22F3/1109 ,  B22F3/24 ,  B22F10/20 ,  B22F10/31 ,  B22F10/36 ,  B23K26/032 ,  B23K26/034 ,  B23K26/0342 ,  B23K26/062 ,  B23K26/064 ,  B23K26/067 ,  B23K26/073 ,  B23K26/21 ,  B23K26/342 ,  B23K26/38 ,  B23K26/704 ,  B29C48/08 ,  B29C64/153 ,  B29C64/264 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  G02B6/02 ,  G02B6/021 ,  G02B6/023 ,  G02B6/02042 ,  G02B6/02347 ,  G02B6/02371 ,  G02B6/02395 ,  G02B6/036 ,  G02B6/03611 ,  G02B6/03694 ,  G02B6/14 ,  G02B6/255 ,  G02B6/4203 ,  G02B6/4206 ,  G02B27/0927 ,  G02B27/0933 ,  G02B27/0994 ,  H01S5/0085 ,  B22F12/44 ,  B22F12/49 ,  G02B6/02004 ,  G02B6/0281 ,  G02B6/0288 ,  G02B6/0365 ,  G02B6/03616 ,  G02B6/03627 ,  G02B6/03633 ,  G02B6/03638 ,  G02B6/03688 ,  G02B6/262 ,  G02B6/4296 ,  G02B26/101 ,  G02B2006/12121 ,  G02F1/0151

Abstract: Disclosed herein are methods, apparatus, and systems for providing an optical beam delivery system, comprising an optical fiber including a first length of fiber comprising a first RIP formed to enable, at least in part, modification of one or more beam characteristics of an optical beam by a perturbation assembly arranged to modify the one or more beam characteristics, the perturbation assembly coupled to the first length of fiber or integral with the first length of fiber, or a combination thereof and a second length of fiber coupled to the first length of fiber and having a second RIP formed to preserve at least a portion of the one or more beam characteristics of the optical beam modified by the perturbation assembly within one or more first confinement regions. The optical beam delivery system may include an optical system coupled to the second length of fiber including one or more free-space optics configured to receive and transmit an optical beam comprising the modified one or more beam characteristics.

公开(公告)号：US20230321752A1

公开(公告)日：2023-10-12

申请号：US18025443

申请日：2021-01-21

Applicant: SHIN-ETSU ENGINEERING CO., LTD.

Inventor： Yoshikazu OHTANI ,  Kyouhei TOMIOKA

IPC: B23K26/062 ,  H01L21/683 ,  B23K26/03

CPC classification number: B23K26/062 ,  H01L21/6835 ,  B23K26/032 ,  B23K2101/40

Abstract: A workpiece separating device for irradiating a laminated body including a workpiece having a circuit substrate bonded with a supporting body via a separating layer with a light, thereby denaturing the separating layer, and peeling the supporting body from the workpiece, the workpiece separating device comprising: a holding member for detachably holding any one of the workpiece side or the supporting body of the laminated body; a light irradiation part for irradiating the light toward the separating layer through the other of the supporting body or the workpiece side of the laminated body held by the holding member; an isolation member for, with respect to any one of the workpiece side or the supporting body of the laminated body, isolating and moving the other in the thickness direction; and a controlling part for operation controlling the light irradiation part and the isolation member.

公开(公告)号：US11772202B2

公开(公告)日：2023-10-03

申请号：US17489417

申请日：2021-09-29

Applicant: NICHIA CORPORATION

Inventor： Takashi Abe ,  Eiji Shirakawa

IPC: H01L33/00 ,  B23K26/53 ,  B23K26/062 ,  H01S5/02 ,  B23K101/40

CPC classification number: B23K26/53 ,  B23K26/062 ,  H01L33/0095 ,  H01S5/0202 ,  H01S5/0213 ,  B23K2101/40

Abstract: In a method for manufacturing a light-emitting element, a second irradiation process includes forming a first modified region at a first distance from a second surface in a thickness direction of a sapphire substrate, forming a second modified region at a second distance from the second surface in the thickness direction, the second distance being less than the first distance, the second modified region being shifted in a first direction from the first modified region, and forming a third modified region at a third distance from the second surface in the thickness direction, the third distance being less than the second distance, the third modified region overlapping the first modified region in a top-view. In the thickness direction of the sapphire substrate, a greater number of modified regions that include second modified portions are formed than modified regions that include first modified portions.

公开(公告)号：US11707802B2

公开(公告)日：2023-07-25

申请号：US16860702

申请日：2020-04-28

Applicant: GM Global Technology Operations LLC

Inventor： Huaxin Li ,  Liang Wang ,  Stephen R. McKenny ,  Daniel J. Wilson

IPC: B23K26/035 ,  B23K26/24 ,  B23K26/06 ,  B23K26/062 ,  B23K26/08 ,  B23K26/60 ,  B23K26/12 ,  H05B6/10 ,  B23K103/04 ,  B23K101/00

CPC classification number: B23K26/035 ,  B23K26/062 ,  B23K26/0665 ,  B23K26/08 ,  B23K26/123 ,  B23K26/60 ,  B23K2101/008 ,  B23K2103/04 ,  H05B6/10

Abstract: Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.