公开(公告)号：US11150092B2

公开(公告)日：2021-10-19

申请号：US16340863

申请日：2017-12-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Imanaka ,  Shoichi Taji ,  Soichiro Hiraoka ,  Katsuya Morinaka

IPC: G01C19/5769 ,  G01C19/5733 ,  G01C19/5747 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L29/84

Abstract: A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.