Abstract:
A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.
Abstract:
An anchor member supports a frame-shaped member. A first input electrode is located outside the frame-shaped member and separate from the frame-shaped member and fixed to a substrate. A second input electrode includes an electrode portion located outside the frame-shaped member and connected to the frame-shaped member. The second input electrode is displaceable in a prescribed direction. A first reference electrode is inside the frame-shaped member and fixed to the substrate. A second reference electrode includes an electrode portion located inside of the frame-shaped member and connected to the frame-shaped member. The second reference electrode is displaceable in the prescribed direction. In the structural component, the first input electrode and the electrode portion of the second input electrode are located between the frame-shaped member and a weight member in the prescribed direction in plan view in a thickness direction defined with respect to the substrate.
Abstract:
An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.