公开(公告)号：US20190120462A1

公开(公告)日：2019-04-25

申请号：US16217380

申请日：2018-12-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kimihiro MURAKAMI ,  Toshihiro KOGA ,  Kazuyuki MATSUMURA

IPC: F21V9/35 ,  F21V5/04 ,  F21V7/04 ,  F21V13/14 ,  F21V14/04

Abstract: A light emission device includes a plurality of light sources, a light deflector that deflects excitation light beams emitted by the plurality of light sources, and a wavelength converter that receives and converts the excitation light beams deflected by the light deflector to wavelength-converted light of a different wavelength, and emits the wavelength-converted light. The light deflector includes one movable mirror on which the excitation light beams are incident along different optical axes. The excitation light beams have equally long optical path lengths from the one movable mirror to the wavelength converter.

公开(公告)号：US20180235040A1

公开(公告)日：2018-08-16

申请号：US15950846

申请日：2018-04-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kazuhiko YAMANAKA ,  Kiyoshi MORIMOTO ,  Hideki KASUGAI ,  Kazuyuki MATSUMURA ,  Hideo YAMAGUCHI ,  Nobuyasu SUZUKI

IPC: H05B33/08 ,  G03B21/20 ,  G02B27/09 ,  F21V17/04 ,  F21V19/00

CPC classification number: H01S5/02469 ,  G02B19/0014 ,  G02B19/0028 ,  G02B19/0052 ,  G03B21/16 ,  G03B21/2033 ,  H01S5/005 ,  H01S5/02 ,  H01S5/02208 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02296 ,  H01S5/024 ,  H01S5/02476

Abstract: A light source device includes: a semiconductor light-emitting device including a flat-shaped base having a first main surface on a first side and a second main surface and a semiconductor light-emitting element disposed on the first side; a first fixing component having a first through-hole and a first pressing surface that presses the first main surface; and a second fixing component having a second through-hole and a second pressing surface that presses the second main surface. The base is fixed between the first and second pressing surfaces by an engagement between a first inner surface surrounding the first through-hole of the first fixing component and a second outer surface of the second fixing component. A distance between the first and second pressing surfaces is smaller than or equal to a thickness of the base, and a void is formed lateral to the base between the first and second pressing surfaces.