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公开(公告)号：US10305008B2
公开(公告)日：2019-05-28
申请号：US15787408
申请日：2017-10-18
Inventor： Takeshi Kawabata , Kiyomi Hagihara , Satoshi Kanai , Takashi Yui
Abstract: A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.
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公开(公告)号：US10546988B2
公开(公告)日：2020-01-28
申请号：US15886543
申请日：2018-02-01
Inventor： Masahiro Hayashi , Tetsuya Kamada , Takashi Kuwaharada , Kiyomi Hagihara , Toshikazu Shimokatano , Shigeo Hayashi , Hiroki Shirozono , Hideaki Usukubo
Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.
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