公开(公告)号：US20200381367A1

公开(公告)日：2020-12-03

申请号：US16872801

申请日：2020-05-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kiyoshi ARITA ,  Shogo OKITA ,  Hidehiko KARASAKI

IPC: H01L23/544 ,  H01L21/66 ,  H01L21/268 ,  H01L21/78 ,  B23K26/57 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/351

Abstract: An element chip manufacturing method including: preparing a semiconductor substrate including a first layer having a first principal surface, and a second layer having a second principal surface, the first layer provided with element regions, a dicing region, and an alignment mark, wherein the first layer includes a semiconductor layer, and the second layer includes a metal layer adjacent to the semiconductor layer; irradiating a first laser beam absorbed in the metal film and passing through the semiconductor layer, from the second principal surface side to a first region corresponding to the mark; imaging the semiconductor substrate from the second principal surface side with a camera, and then calculating a second region corresponding to the dicing region on the second principal surface; irradiating a second laser beam to the second region from the second principal surface side; and dicing the semiconductor substrate into a plurality of element chips.