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公开(公告)号：US12286500B2
公开(公告)日：2025-04-29
申请号：US18284386
申请日：2022-03-24
Inventor： Taichi Nakashima , Hiroyuki Fujisawa , Akira Otsuka , Koichi Isaji , Hajime Ogushi
IPC: C08F290/06 , C08J5/24 , C08K9/06 , H05K1/03
Abstract: A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).
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公开(公告)号：US10785868B2
公开(公告)日：2020-09-22
申请号：US16336698
申请日：2017-07-27
Inventor： Kenichi Toshimitsu , Daisuke Nii , Koichi Isaji , Hiroyuki Fujisawa , Yoshihiko Nakamura
Abstract: A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.
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