公开(公告)号：US11027458B2

公开(公告)日：2021-06-08

申请号：US16082318

申请日：2017-02-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroyuki Fujisawa ,  Kenichi Toshimitsu ,  Yoshihiko Nakamura

IPC: B32B27/20 ,  B32B7/00 ,  C08J5/24 ,  B29B15/12 ,  H05K1/03 ,  B32B5/02 ,  B32B5/26 ,  B32B5/28 ,  B32B17/04 ,  B32B27/38

Abstract: The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 μm to 30 μm. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.

公开(公告)号：US12286500B2

公开(公告)日：2025-04-29

申请号：US18284386

申请日：2022-03-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Taichi Nakashima ,  Hiroyuki Fujisawa ,  Akira Otsuka ,  Koichi Isaji ,  Hajime Ogushi

IPC: C08F290/06 ,  C08J5/24 ,  C08K9/06 ,  H05K1/03

Abstract: A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

公开(公告)号：US10785868B2

公开(公告)日：2020-09-22

申请号：US16336698

申请日：2017-07-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kenichi Toshimitsu ,  Daisuke Nii ,  Koichi Isaji ,  Hiroyuki Fujisawa ,  Yoshihiko Nakamura

IPC: H05K1/03 ,  D03D1/00 ,  D03D15/00 ,  H05K1/02 ,  H05K3/46

Abstract: A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.