公开(公告)号：US10785868B2

公开(公告)日：2020-09-22

申请号：US16336698

申请日：2017-07-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kenichi Toshimitsu ,  Daisuke Nii ,  Koichi Isaji ,  Hiroyuki Fujisawa ,  Yoshihiko Nakamura

IPC: H05K1/03 ,  D03D1/00 ,  D03D15/00 ,  H05K1/02 ,  H05K3/46

Abstract: A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.

公开(公告)号：US10017601B2

公开(公告)日：2018-07-10

申请号：US14901996

申请日：2014-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Daisuke Nii ,  Mitsuyoshi Nishino ,  Fuminori Sato ,  Yoshihiko Nakamura

IPC: H01B3/40 ,  C08G59/42 ,  C08J5/24 ,  C08K5/49 ,  C08K9/06 ,  C08J5/10 ,  B32B15/08 ,  B32B27/38 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08K3/013 ,  C08K5/5399 ,  C08K5/00

CPC classification number: C08G59/4284 ,  B32B5/02 ,  B32B5/26 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2307/732 ,  B32B2457/08 ,  C08G59/42 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/0066 ,  C08K5/49 ,  C08K5/5399 ,  C08K9/06 ,  C08L63/00

Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

公开(公告)号：US10543661B2

公开(公告)日：2020-01-28

申请号：US15753571

申请日：2016-09-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akihiro Yamauchi ,  Yoshiaki Esaki ,  Takayoshi Ozeki ,  Hiroaki Umehara ,  Hiroharu Inoue ,  Yoshihiko Nakamura

IPC: B32B15/08 ,  B32B15/092 ,  C08G59/62 ,  H05K1/03 ,  C08G65/44 ,  C08K3/36 ,  C08L63/00

Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.

公开(公告)号：US09775239B2

公开(公告)日：2017-09-26

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tatsuya Arisawa ,  Yoshihiko Nakamura ,  Tomoyuki Abe ,  Kiyotaka Komori ,  Syouji Hasimoto ,  Mitsuyoshi Nishino

IPC: H05K1/00 ,  H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  H05K3/00 ,  C08J5/10

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

公开(公告)号：US11027458B2

公开(公告)日：2021-06-08

申请号：US16082318

申请日：2017-02-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroyuki Fujisawa ,  Kenichi Toshimitsu ,  Yoshihiko Nakamura

IPC: B32B27/20 ,  B32B7/00 ,  C08J5/24 ,  B29B15/12 ,  H05K1/03 ,  B32B5/02 ,  B32B5/26 ,  B32B5/28 ,  B32B17/04 ,  B32B27/38

Abstract: The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 μm to 30 μm. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.