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公开(公告)号:US10457907B2
公开(公告)日:2019-10-29
申请号:US15277728
申请日:2016-09-27
Inventor: Atsushi Shunori , Masahiro Yasumi , Makoto Takahashi
IPC: G01N27/403 , G01N33/487 , G01N33/50 , C12M1/34 , C12Q1/04 , G01N33/543 , C12Q1/02
Abstract: An electrochemical measurement device includes: a base; a specimen placement portion disposed on the base, for placing a biological specimen; a first electrode disposed on the base and surrounding the specimen placement portion; and a first insulating layer covering the first electrode. The first insulating layer has a plurality of openings, and the first electrode has a plurality of first electrode exposed portions which are portions of the first electrode that are exposed from the openings of the first insulating layer.
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公开(公告)号:US10458941B2
公开(公告)日:2019-10-29
申请号:US15606553
申请日:2017-05-26
Inventor: Jun Ogihara , Sumihiro Otsuka , Noriteru Furumoto , Masahiro Yasumi , Atsushi Shunori
IPC: G01N27/28 , G01N27/416 , G01N33/483
Abstract: Provided is an electrochemical measurement device capable of measuring more accurately and an electrochemical measurement apparatus provided with the electrochemical measurement device. The electrochemical measurement device includes a base part, and a placement part on which an object to be measured is placed, the placement part being provided to the base part. The electrochemical measurement device also includes an electrode part provided near the placement part on the base part, a wiring part provided on a surface of the base part and electrically connected to the electrode part, and an insulator that covers the wiring part. Further, a protruding part is provided on the base part of the electrochemical measurement device so as to protrude past the insulator.
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公开(公告)号:US10241077B2
公开(公告)日:2019-03-26
申请号:US15361533
申请日:2016-11-28
Inventor: Hiroshi Ushio , Masahiro Yasumi
IPC: G01N33/487 , G01N27/416 , C12M1/34
Abstract: An electrochemical measurement device includes a chip, a working electrode, a first connection portion, a substrate, a second connection portion, a third connection portion, and an upper plate. The working electrode is disposed on the upper surface of the chip. The first connection portion is disposed on the upper surface of the chip, and is electrically connected to the working electrode. The second connection portion is disposed on the upper surface of the substrate. The third connection portion is disposed on the substrate, is electrically connected to the second connection portion, and is to be electrically connected to an external apparatus. The upper plate is disposed on the upper surfaces of the substrate and chip. The upper plate is provided with a first through hole through which the working electrode is exposed.
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