公开(公告)号：US09925704B2

公开(公告)日：2018-03-27

申请号：US14441442

申请日：2013-09-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Nakagawa ,  Mitsuhiro Yoshinaga

IPC: B29C45/14 ,  B29B11/00 ,  B29C45/72 ,  B29K101/00 ,  B29K703/00 ,  B29L9/00 ,  B29L31/30 ,  B29L31/00

CPC classification number: B29C45/14827 ,  B29B11/00 ,  B29C45/14262 ,  B29C45/14811 ,  B29C45/7207 ,  B29K2101/00 ,  B29K2703/00 ,  B29K2715/006 ,  B29K2995/002 ,  B29K2995/0087 ,  B29L2009/00 ,  B29L2031/30 ,  B29L2031/762

Abstract: An in-mold molding method of the present invention is a method including: placing an in-mold transfer film in the cavity of an injection molding mold, the in-mold transfer film having a hard coating layer and a transfer section of a printed layer; and peeling, from the base material film of the in-mold transfer film, the transfer section transferred to a molding resin when a molding molded by injecting the molding resin into the cavity is removed by mold opening. The hard coating layer is ruptured in a mold opening process while the in-mold transfer film has a necessary elongation of A % on the side of the molding and the hard coating layer has a rupture elongation of at least A %+2% and less than A %+40% on the side of the molding. With this configuration, the in-mold transfer film can be stably peeled during in-mold molding.