公开(公告)号：US12205823B2

公开(公告)日：2025-01-21

申请号：US17550309

申请日：2021-12-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Toshiyuki Takasaki ,  Ryota Furukawa ,  Atsushi Harikai ,  Shogo Okita

IPC: H01L21/3065 ,  H01L21/311 ,  H01L21/78

Abstract: Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substrate 10 that is held on a holding sheet 22 that is supported by a frame 21, the substrate including element regions and dicing regions; a protective film forming step of forming a protective film 15 so as to cover the frame 21, the holding sheet 22, and the substrate 10; a patterning step of removing a part of the protective film 15 so as to expose the dicing regions of the substrate 10; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrate 10 into a plurality of element chips; and a fluorine removing step of removing, together with the protective film 15, fluorine attached to the protective film 15 in the plasma dicing step.