MULTILAYER ELECTRONIC COMPONENT PRODUCTION METHOD

    公开(公告)号:US20220310291A1

    公开(公告)日:2022-09-29

    申请号:US17838961

    申请日:2022-06-13

    Abstract: A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

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