公开(公告)号：US20250121461A1

公开(公告)日：2025-04-17

申请号：US18982596

申请日：2024-12-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUMI TAKAO ,  KIYOHIRO HINE ,  AKIO FURUSAWA ,  SHINJI ISHITANI ,  HIROHISA HINO

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/362

Abstract: A bonding material includes: a single particle that is a particle of a first metal; a composite particle including a central core that is a particle of the first metal, and at least one coating layer covering an entire surface of the central core, the at least one coating layer including a fine particle of a second metal; and a flux including a reducing agent component, in which the first metal and the second metal have properties of forming an intermetallic compound of the first metal and the second metal, and the reducing agent component of the flux is present between the central core and the at least one coating layer.

公开(公告)号：US20250108463A1

公开(公告)日：2025-04-03

申请号：US18978382

申请日：2024-12-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KIYOHIRO HINE ,  YUMI TAKAO ,  HIROHISA HINO ,  SHINJI ISHITANI ,  AKIO FURUSAWA

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K101/42 ,  C22C13/02 ,  H05K1/18

Abstract: A bonding material includes a solder alloy having a median diameter D50 of 100 nm to 2000 nm, made from Sn, Bi, In, and other unavoidable components, and having a melting point of less than or equal to 100° C., metal nanoparticles that are Cu nanoparticles having a median diameter D50 of 50 nm to 500 nm, and a flux, wherein the metal nanoparticles include a protective film on a surface of the metal nanoparticles, the protective film separating at a temperature higher than a melting point of the solder alloy and lower than 100° C., and a weight ratio between the solder alloy and the metal nanoparticles is a ratio at which all Sn and In contained in the solder alloy become intermetallic compounds with the metal nanoparticles in an equilibrium state diagram.